Electroless cobalt deposition from ammonia borane solutions

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dc.contributor.authorRohan, James F.
dc.contributor.authorNagle, Lorraine C.
dc.contributor.authorLoughlin, Alan
dc.date.accessioned2019-03-13T16:31:47Z
dc.date.available2019-03-13T16:31:47Z
dc.date.issued2007-02
dc.date.updated2019-03-13T16:29:11Z
dc.description.abstractAmmonia borane (AB) has been used as a reducing agent in the deposition of cobalt on copper substrates. The bath composition for selective deposition was investigated. The mobile ion free plating bath was pH balanced and buffered using tetramethyl ammonium hydroxide. The codeposition of W with Co was achieved utilising tungstic acid. The electrochemical analysis of cobalt deposition and AB oxidation at the operating pH of 9 indicate that the deposition on copper is faster than that on cobalt and that the reaction rate decreases as the deposition proceeds.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationRohan, James F.; Nagle, Lorraine C.; Loughlin, Alan (2007) 'Electroless Cobalt Deposition from Ammonia Borane Solutions'. ECS Transactions, 2 (6):51-59.en
dc.identifier.doi10.1149/1.2408863
dc.identifier.endpage59en
dc.identifier.issn1938-5862
dc.identifier.issued6en
dc.identifier.journaltitleECS Transactionsen
dc.identifier.startpage51en
dc.identifier.urihttps://hdl.handle.net/10468/7621
dc.identifier.volume2en
dc.language.isoenen
dc.publisherElectrochemical Societyen
dc.relation.urihttp://ecst.ecsdl.org/content/2/6/51
dc.rights© 2007 ECS - The Electrochemical Societyen
dc.subjectCobalten
dc.subjectElectrodepositionen
dc.subjectElectroless platingen
dc.subjectOxidationen
dc.subjectOxidesen
dc.subjectpH effectsen
dc.subjectSubstratesen
dc.subjectAmmonia borane solutionsen
dc.subjectCobalt depositionen
dc.subjectCopper substratesen
dc.titleElectroless cobalt deposition from ammonia borane solutionsen
dc.typeArticle (peer-reviewed)en
dc.typeConference itemen
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