2026-09-21T16:46:12Zhttps://cora.ucc.ie/server/oai/request

oai:cora.ucc.ie:10468/27392023-04-04T06:56:59Zcom_10468_388com_10468_5com_10468_1com_10468_129com_10468_41com_10468_6col_10468_389col_10468_140col_10468_581col_10468_3619

No This thesis is due for publication or the author is actively seeking to publish this material Razeeb Mahmood, Kafil Mathewson, Alan Tao, Jing European Union 2016-06-15T10:53:04Z 2016 2016 Semiconductor chip packaging has evolved from single chip packaging to 3D heterogeneous system integration using multichip stacking in a single module. One of the key challenges in 3D integration is the high density interconnects that need to be formed between the chips with through-silicon-vias (TSVs) and inter-chip interconnects. Anisotropic Conductive Film (ACF) technology is one of the low-temperature, fine-pitch interconnect method, which has been considered as a potential replacement for solder interconnects in line with continuous scaling of the interconnects in the IC industry. However, the conventional ACF materials are facing challenges to accommodate the reduced pad and pitch size due to the micro-size particles and the particle agglomeration issue. A new interconnect material - Nanowire Anisotropic Conductive Film (NW-ACF), composed of high density copper nanowires of ~ 200 nm diameter and 10-30 µm length that are vertically distributed in a polymeric template, is developed in this work to tackle the constrains of the conventional ACFs and serves as an inter-chip interconnect solution for potential three-dimensional (3D) applications. European Union (FP7 scheme project e-BRAINS FP7-ICT-257488) Not peer reviewed Accepted Version application/pdf Tao, J. 2016. Nanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnect. PhD Thesis, University College Cork. 187 https://hdl.handle.net/10468/2739 en University College Cork © 2016, Jing Tao. http://creativecommons.org/licenses/by-nc-nd/3.0/ Reliability 3D integration Nanowire anisotropic conductive film (NW-ACF) Electrochemical deposition Thermocompression bonding Fine-pitch interconnection Daisy-chain resistance Bonding interface analysis Shear strength RF transmission Thermal impedance false Nanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnect Doctoral thesis Doctoral PHD (Engineering) kafil.mahmood@tyndall.ieinfo:eu-repo/semantics/openAccess