PCB embedded toroidal inductor for 2MHz point-of-load converter

Abstract

Increasing switching frequency, enabled by advances in discrete silicon switches, monolithic CMOS/LDMOS switching bridges and GaN HEMTs, have resulted in a lower inductance requirement for the DC-DC power converter. High density, high efficiency magnetic materials are required to support the increasing power semiconductor switching frequencies. Advanced packaging technologies allow magnetic devices to be integrated within the package substrate of the application Printed Circuit Board (PCB). This paper provides an overview of the magnetic core embedding process technology and a procedure to characterise the magnetic material after its co-processing during the PCB manufacturing process.