The high frequency electrical properties of interconnects on a flexible polyimide substrate including the effects of humidity

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dc.contributor.author McGibney, Eoin
dc.contributor.author Barton, John
dc.contributor.author Floyd, Liam
dc.contributor.author Tassie, Paul
dc.contributor.author Barrett, John
dc.date.accessioned 2011-09-15T16:18:36Z
dc.date.available 2011-09-15T16:18:36Z
dc.date.issued 2011-01
dc.identifier.citation McGibney, E.; Barton, J.; Floyd, L.; Tassie, P.; Barrett, J (2011) 'The High Frequency Electrical Properties of Interconnects on a Flexible Polyimide Substrate Including the Effects of Humidity'. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1 (1):4-15. doi: 10.1109/TCPMT.2010.2100731 en
dc.identifier.volume 1
dc.identifier.issued 1
dc.identifier.startpage 4
dc.identifier.endpage 15
dc.identifier.issn 2156-3950
dc.identifier.uri http://hdl.handle.net/10468/422
dc.identifier.doi 10.1109/TCPMT.2010.2100731
dc.description.abstract Flexible circuit board materials can be used to advantage in radio frequency and high-speed digital systems but an obstacle to their use is the lack of availability of information on the electrical properties of materials to high frequencies and, in particular, the variation in dielectric constant and loss tangent as a function of frequency. This makes accurate electromagnetic simulation of high frequency flexible interconnects difficult. The variation of the electrical properties of these materials as a function of environmental parameters, such as humidity, is also unknown at higher frequencies. This paper has, using microwave resonators, investigated the electrical properties from 2 GHz to 18 GHz of a polyimide flexible circuit board material saturated at 25% RH and at 85% RH relative humidity levels. Rigid circuit board materials FR4 and CER-10 were also measured as reference materials. The relative permittivity, epsilon(r), total loss, alpha(T), and loss tangent, tan delta, have been extracted from the measurements for each material. The strong influence of conductor losses on overall losses when using thin materials such as flex at high frequency has also been evaluated and quantified in these measurements. In addition to the resonators used for measurement of material electrical properties, microstrip transmission lines were also included on each test sample and their s-parameters were measured at the same time and under the same conditions as the resonators. Comparisons between the measured electrical performance of the microstrip transmission lines and simulations of the lines based on the extracted material parameters show a high degree of correlation, indicating the validity of both the use of the resonator approach and overall loss measurement methodologies. en
dc.description.sponsorship Science Foundation Ireland (NAP-72); Science Foundation Ireland (CSET - Centre for Science, Engineering and Technology, Grant No. 07/CE/11147); Ireland’s EU Structural Funds Programme 2007–2013, co-funded by the Irish Government and the European Commission, in the Fourth Cycle of the Programme for Research in Third Level Institutions “PRTLI-IV” as part of the M-Zones Research Programme en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IEEE en
dc.relation.uri http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5734805&isnumber=5738414
dc.rights © 2011 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Electrical characterization en
dc.subject Flexible substrates en
dc.subject High frequency en
dc.subject Material properties en
dc.subject.lcsh Dielectric measurements en
dc.subject.lcsh Electronic measurements en
dc.title The high frequency electrical properties of interconnects on a flexible polyimide substrate including the effects of humidity en
dc.type Article (peer-reviewed) en
dc.internal.authorurl http://www.tyndall.ie/mai/staff/johnbarton.htm en
dc.internal.authorurl http://www.tyndall.ie/mai/staff/paultassie.htm en
dc.internal.authorcontactother John Barton, Tyndall National Institute, Lee Maltings, Prospect Row, Cork, Ireland. Email: john.barton@tyndall.ie en
dc.internal.authorcontactother Liam Floyd, Tyndall National Institute, Lee Maltings, Prospect Row, Cork, Ireland. en
dc.internal.authorcontactother Paul Tassie, Tyndall National Institute, Lee Maltings, Prospect Row, Cork, Ireland. Email: paul.tassie@tyndall.ie en
dc.internal.availability Full text available en
dc.internal.webversions http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5734805&isnumber=5738414
dc.date.updated 2011-09-15T16:01:58Z
dc.description.version Accepted Version en
dc.internal.rssid 102259646
dc.internal.wokid 000292778000002
dc.contributor.funder Science Foundation Ireland en
dc.contributor.funder Irish Government en
dc.contributor.funder European Commission en
dc.description.status Peer reviewed en
dc.identifier.journaltitle IEEE Transactions on Components, Packaging and Manufacturing Technology


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