Silver nanowire array-polymer composite as thermal interface material

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dc.contributor.author Xu, Ju
dc.contributor.author Munari, Alessio
dc.contributor.author Dalton, Eric
dc.contributor.author Mathewson, Alan
dc.contributor.author Razeeb, Kafil M.
dc.date.accessioned 2017-09-20T10:06:35Z
dc.date.available 2017-09-20T10:06:35Z
dc.date.issued 2009
dc.identifier.citation Xu, J., Munari, A., Dalton, E., Mathewson, A. and Razeeb, K. M. (2009) 'Silver nanowire array-polymer composite as thermal interface material', Journal of Applied Physics, 106(12), 124310 (7pp). doi: 10.1063/1.3271149 en
dc.identifier.volume 106
dc.identifier.issued 12
dc.identifier.startpage 1
dc.identifier.endpage 7
dc.identifier.issn 0021-8979
dc.identifier.uri http://hdl.handle.net/10468/4748
dc.identifier.doi 10.1063/1.3271149
dc.description.abstract Silver nanowire arrays embedded inside polycarbonate templates are investigated as a viable thermal interface material for electronic cooling applications. The composite shows an average thermal diffusivity value of 1.89x10(-5) m(2) s(-1), which resulted in an intrinsic thermal conductivity of 30.3 W m(-1) K(-1). The nanowires' protrusion from the film surface enables it to conform to the surface roughness to make a better thermal contact. This resulted in a 61% reduction in thermal impedance when compared with blank polymer. An similar to 30 nm Au film on the top of the composite was found to act as a heat spreader, reducing the thermal impedance further by 35%. A contact impedance model was employed to compare the contact impedance of aligned silver nanowire-polymer composites with that of aligned carbon nanotubes, which showed that the Young's modulus of the composite is the defining factor in the overall thermal impedance of these composites. en
dc.description.sponsorship Enterprise Ireland [CFTD/2008/322] en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher AIP Publishing en
dc.relation.uri http://aip.scitation.org/doi/10.1063/1.3271149
dc.rights © 2009, American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Xu, J., Munari, A., Dalton, E., Mathewson, A. and Razeeb, K. M. (2009) 'Silver nanowire array-polymer composite as thermal interface material', Journal of Applied Physics, 106(12), 124310 (7pp). doi: 10.1063/1.3271149 and may be found at http://aip.scitation.org/doi/10.1063/1.3271149 en
dc.subject Carbon nanotubes en
dc.subject Composite material interfaces en
dc.subject Gold en
dc.subject Metallic thin films en
dc.subject Nanocomposites en
dc.subject Nanowires en
dc.subject Polymers en
dc.subject Silver en
dc.subject Surface roughness en
dc.subject Thermal conductivity en
dc.subject Thermal diffusivity en
dc.subject Young's modulus en
dc.title Silver nanowire array-polymer composite as thermal interface material en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Kafil M. Razeeb, Tyndall National Institute, University College Cork, Cork, Ireland +353-21-490-3000 Email: kafil.mahmood@tyndall.ie en
dc.internal.availability Full text available en
dc.description.version Published Version en
dc.contributor.funder Enterprise Ireland
dc.contributor.funder Science Foundation Ireland
dc.description.status Peer reviewed en
dc.identifier.journaltitle Journal of Applied Physics en
dc.internal.IRISemailaddress kafil.mahmood@tyndall.ie en
dc.identifier.articleid 124310
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Centre for Science Engineering and Technology (CSET)/03/CE3/I405/IE/CSET CTVR: Centre for Telecommunications Value Chain Driven Research (CTVR)/


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