III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

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dc.contributor.authorZhang, Jing
dc.contributor.authorMuliuk, Grigorij
dc.contributor.authorJuvert, Joan
dc.contributor.authorKumari, Sulakshna
dc.contributor.authorGoyvaerts, Jeroen
dc.contributor.authorHaq, Bahawal
dc.contributor.authorde Beeck, Camiel Op
dc.contributor.authorKuyken, Bart
dc.contributor.authorMorthier, Geert
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorBaets, Roel
dc.contributor.authorLepage, Guy
dc.contributor.authorVerheyen, Peter
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorGocalińska, Agnieszka M.
dc.contributor.authorO'Callaghan, James
dc.contributor.authorPelucchi, Emanuele
dc.contributor.authorThomas, Kevin
dc.contributor.authorCorbett, Brian
dc.contributor.authorTrindade, António José
dc.contributor.authorRoelkens, Gunther
dc.contributor.funderVlaamse regeringen
dc.contributor.funderHorizon 2020en
dc.contributor.funderIrish Photonic Integration Centreen
dc.date.accessioned2019-12-05T11:15:32Z
dc.date.available2019-12-05T11:15:32Z
dc.date.issued2019-10-04
dc.description.abstractSilicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs.en
dc.description.statusPeer revieweden
dc.description.versionPublished Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.articleid110803en
dc.identifier.citationZhang, J., Muliuk, G., Juvert, J., Kumari, S., Goyvaerts, J., Haq, B., Beeck, C. O. d., Kuyken, B., Morthier, G., Thourhout, D. V., Baets, R., Lepage, G., Verheyen, P., Campenhout, J. V., Gocalinska, A., O’Callaghan, J., Pelucchi, E., Thomas, K., Corbett, B., Trindade, A. J. and Roelkens, G. (2019) 'III-V-on-Si photonic integrated circuits realized using micro-transfer-printing', APL Photonics, 4(11), 110803. (11pp.) doi: 10.1063/1.5120004en
dc.identifier.doi10.1063/1.5120004en
dc.identifier.eissn2378-0967
dc.identifier.endpage11en
dc.identifier.issued11en
dc.identifier.journaltitleAPL Photonicsen
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/9339
dc.identifier.volume4en
dc.language.isoenen
dc.publisherAIP Publishingen
dc.rights©2019 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). https://doi.org/10.1063/1.5120004., sen
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en
dc.subjectIII-V-on-Sien
dc.subjectPhotonicen
dc.subjectIntegrated circuitsen
dc.subjectMicro-transfer-printingen
dc.titleIII-V-on-Si photonic integrated circuits realized using micro-transfer-printingen
dc.typeArticle (peer-reviewed)en
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