Mechanism for the atomic layer deposition of copper using diethylzinc as the reducing agent – a density functional theory study using gas phase molecules as a model

dc.check.infoAccess to this article is restricted for 12 months after original publication by request of the publisher.en
dc.contributor.authorDey, Gangotri
dc.contributor.authorElliott, Simon D.
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2013-04-10T15:52:46Z
dc.date.available2013-08-15T04:00:03Z
dc.date.copyright2012-08
dc.date.issued2012-08-14
dc.description.abstractWe present theoretical studies based on first-principles density functional theory calculations for the possible gas-phase mechanism of the atomic layer deposition (ALD) of copper by transmetalation from common precursors such as Cu(acac)(2), Cu(hfac)(2), Cu(PyrIm(R))(2) with R = (i)Pr and Et, Cu(dmap)(2), and CuCl(2) where diethylzinc acts as the reducing agent. An effect on the geometry and reactivity of the precursors due to differences in electronegativity, steric hindrance, and conjugation present in the ligands was observed. Three reaction types, namely, disproportionation, ligand exchange, and reductive elimination, were considered that together comprise the mechanism for the formation of copper in its metallic state starting from the precursors. A parallel pathway for the formation of zinc in its metallic form was also considered. The model Cu(I) molecule Cu(2)L(2) was studied, as Cu(I) intermediates at the surface play an important role in copper deposition. Through our study, we found that accumulation of an LZnEt intermediate results in zinc contamination by the formation of either Zn(2)L(2) or metallic zinc. Ligand exchange between Cu(II) and Zn(II) should proceed through a Cu(I) intermediate, as otherwise, it would lead to a stable copper molecule rather than copper metal. Volatile ZnL(2) favors the ALD reaction, as it carries the reaction forward.en
dc.description.sponsorshipScience Foundation Ireland (09.IN1.I2628)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationDey, G and Elliott, S. D. (2012). Mechanism for the atomic layer deposition of copper using diethylzinc as the reducing agent – a Density Functional Theory study using gas phase molecules as a model. Journal of Physical Chemistry A, 116 (35), pp 8893–8901. DOI: 10.1021/jp304460zen
dc.identifier.doi10.1021/jp304460z
dc.identifier.endpage8901en
dc.identifier.issued35en
dc.identifier.journaltitleJournal of Physical Chemistry Aen
dc.identifier.startpage8893en
dc.identifier.urihttps://hdl.handle.net/10468/1054
dc.identifier.volume116en
dc.language.isoenen
dc.publisherAmerican Chemical Society Publicationsen
dc.relation.urihttp://pubs.acs.org/doi/abs/10.1021/jp304460z
dc.rights© 2012, American Chemical Society. This document is the Accepted Manuscript version of a Published Work that appeared in final form in the Journal of Physical Chemistry A, copyright © American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see http://pubs.acs.org/doi/abs/10.1021/jp304460zen
dc.subjectCopper atomic layer depositionen
dc.subjectDiethylzincen
dc.subjectReducing agenten
dc.subjectDensity functional theoryen
dc.titleMechanism for the atomic layer deposition of copper using diethylzinc as the reducing agent – a density functional theory study using gas phase molecules as a modelen
dc.typeArticle (peer-reviewed)en
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