Multivalley electron conduction at the indirect-direct crossover point in highly tensile-strained germanium
dc.contributor.author | Clavel, M. B. | |
dc.contributor.author | Murphy-Armando, Felipe | |
dc.contributor.author | Xie, Y. | |
dc.contributor.author | Henry, K. T. | |
dc.contributor.author | Kuhn, M. | |
dc.contributor.author | Bodnar, R. J. | |
dc.contributor.author | Khodaparast, G. A. | |
dc.contributor.author | Smirnov, D. | |
dc.contributor.author | Heremans, J. J. | |
dc.contributor.author | Hudait, M. K. | |
dc.date.accessioned | 2023-01-17T16:28:29Z | |
dc.date.available | 2023-01-17T16:28:29Z | |
dc.date.issued | 2022-12-27 | |
dc.date.updated | 2023-01-10T09:21:51Z | |
dc.description.abstract | As forward-looking electron devices increasingly adopt high-mobility low-band-gap materials, such as germanium (Ge), questions remain regarding the feasibility of strain engineering in low-band-gap systems. Particularly, the Ge L-Γ valley separation (∼150 meV) can be overcome by introducing a high degree of tensile strain (ε ≥ 1.5%). It is therefore essential to understand the nature of highly strained Ge transport, wherein multivalley electron conduction becomes a possibility. Here, we report on the competitiveness between L- and Γ-valley transport in highly tensile-strained (ε ∼ 1.6%) Ge/In0.24Ga0.76 Asheterostructures. Temperature-dependent magnetotransport analysis reveals two contributing carrier populations, identified as lower- and higher-mobility L- and Γ-valley electrons (in Ge), using temperature-dependent Boltzmann transport modeling. Coupling this interpretation with electron-cyclotron-resonance studies, the effective mass (m*) of the higher-mobility Γ-valley electrons is probed, revealing m* = (0.049 ± 0.007)me. Moreover, a comparison of empirical and theoretical m* indicates that these electrons reside primarily in the first-two quantum sublevels of the Ge Γ valley. Consequently, our results provide an insight into the strain-dependent carrier dynamics of Ge, offering alternative pathways toward efficacious strain engineering. | en |
dc.description.status | Peer reviewed | en |
dc.description.version | Published Version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.articleid | 064083 | en |
dc.identifier.citation | Clavel, M. B., Murphy-Armando, F., Xie, Y., Henry, K. T., Kuhn, M., Bodnar, R. J., Khodaparast, G. A., Smirnov, D., Heremans, J. J. and Hudait, M. K. (2022) 'Multivalley electron conduction at the indirect-direct crossover point in highly tensile-strained germanium', Physical Review Applied, 18(6), 064083 (13pp). doi: 10.1103/PhysRevApplied.18.064083 | en |
dc.identifier.doi | 10.1103/PhysRevApplied.18.064083 | en |
dc.identifier.eissn | 2331-7019 | |
dc.identifier.endpage | 13 | en |
dc.identifier.issued | 6 | en |
dc.identifier.journaltitle | Physical Review Applied | en |
dc.identifier.startpage | 1 | en |
dc.identifier.uri | https://hdl.handle.net/10468/14085 | |
dc.identifier.volume | 18 | en |
dc.language.iso | en | en |
dc.publisher | American Physical Society | en |
dc.rights | © 2022, American Physical Society. | en |
dc.subject | Straintronics | en |
dc.subject | Transport phenomena | en |
dc.subject | Elemental semiconductors | en |
dc.subject | Narrow band | en |
dc.subject | Gap systems | en |
dc.subject | Boltzmann theory | en |
dc.subject | Cyclotron resonance | en |
dc.subject | Density functional theory development | en |
dc.title | Multivalley electron conduction at the indirect-direct crossover point in highly tensile-strained germanium | en |
dc.type | Article (peer-reviewed) | en |
Files
Original bundle
1 - 2 of 2
Loading...
- Name:
- NW10262_Accepted_version-11-21-2022.pdf
- Size:
- 3.3 MB
- Format:
- Adobe Portable Document Format
- Description:
- Accepted Version
Loading...
- Name:
- Supplementary_Information-nw10262-Accepted_Version_11-17-2022.pdf
- Size:
- 1.78 MB
- Format:
- Adobe Portable Document Format
- Description:
- Supplemental Material
License bundle
1 - 1 of 1
Loading...
- Name:
- license.txt
- Size:
- 2.71 KB
- Format:
- Item-specific license agreed upon to submission
- Description: