Design and optimization techniques of over-chip bond-wire microtransformers with LTCC core

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dc.contributor.authorCamarda, Antonio
dc.contributor.authorMacrelli, Enrico
dc.contributor.authorPaganelli, Rudi Paolo
dc.contributor.authorTartagni, Marco
dc.contributor.authorRoy, Saibal
dc.contributor.authorRomani, Aldo
dc.date.accessioned2019-01-07T11:29:53Z
dc.date.available2019-01-07T11:29:53Z
dc.date.issued2017-09-13
dc.date.updated2018-11-26T18:33:48Z
dc.description.abstractThis paper describes the realization of bond-wire micromagnetics by using standard bonding wires and a toroidal ferromagnetic low-temperature co-fired ceramic core with high resistivity. The proposed fabrication procedure is suitable for the development of magnetic components on the top of an integrated circuit with a small profile and a small size (<;15 mm 2 ). A transformer is designed and applied over chip, working in the MHz range with high inductance (~33 μH) and high effective turns ratio (~20). Applications include bootstrap circuits and micropower conversion for energy harvesting. Measurements demonstrate a maximum secondary Q-factor of 11.6 at 1.3 MHz, and a coupling coefficient of 0.65 with an effective turns ratio of 19, which are among the highest values reported for toroidal miniaturized magnetics. The achieved inductance density is 2 μH/mm 2 , along with an inductance per unit core volume of 15.6 μH/mm 3 , and a dc inductance-to-resistance ratio of 2.23 μH/Ω. The presented technique allows to obtain over-chip magnetics trough a postprocessing of the core, and it is also suitable for high-density power supply in package and power supply on-chip. Finally, a series of optimization techniques for planar core magnetic devices in order to maximize the inductance per unit area is discussed and applied to the considered case.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationCamarda, A., Macrelli, E., Paganelli, R. P., Tartagni, M., Roy, S. and Romani, A. (2018) 'Design and optimization techniques of over-chip bond-wire microtransformers with LTCC core', IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(2), pp. 592-603. doi:10.1109/JESTPE.2017.2751745en
dc.identifier.doi10.1109/JESTPE.2017.2751745
dc.identifier.endpage603en
dc.identifier.issn2168-6777
dc.identifier.issn2168-6785
dc.identifier.issued2en
dc.identifier.journaltitleIEEE Journal of Emerging and Selected Topics in Power Electronicsen
dc.identifier.startpage592en
dc.identifier.urihttps://hdl.handle.net/10468/7259
dc.identifier.volume6en
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.rights© 2017, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectEnergy harvesting applicationsen
dc.subjectOn-chipen
dc.subjectBoost converteren
dc.subjectMagnetic-coreen
dc.subjectPoweren
dc.subjectInductorsen
dc.subjectTransformeren
dc.subjectSiliconen
dc.subjectFabricationen
dc.titleDesign and optimization techniques of over-chip bond-wire microtransformers with LTCC coreen
dc.typeArticle (peer-reviewed)en
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