Flip-chip bonded micro-thermoelectric coolers for on-chip thermal management in integrated photonics

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dc.check.date2026-09-26en
dc.check.infoAccess to this article is restricted until 12 months after publication by request of the publisheren
dc.contributor.authorKaur, Rajvinderen
dc.contributor.authorTanwar, Amiten
dc.contributor.authorO’Brien, Peteren
dc.contributor.authorRazeeb, Kafil M.en
dc.contributor.funderResearch Irelanden
dc.contributor.funderScience Foundation Irelanden
dc.contributor.funderEuropean Regional Development Funden
dc.contributor.funderHORIZON EUROPE Framework Programmeen
dc.date.accessioned2025-10-08T08:39:22Z
dc.date.available2025-10-08T08:39:22Z
dc.date.issued2025-09-26en
dc.description.abstractThermal management is a key challenge in high-density integrated photonics, where local hotspots destabilize the wavelength of the photonic device and degrade overall performance. Unlike conventional cooling strategies, micro-thermoelectric coolers (micro-TECs) offer a compact, solid-state, microfabrication-compatible solution for localized, on-chip cooling and precise thermal management. In this work, micro-TEC devices are fabricated on Si/SiO2 substrate using electrodeposited n-type Bi2Te3 and p-type CuSbTe thermoelectric materials. The 4.4 × 4.4 mm2-sized devices comprise n- and p-type thermoelectric leg-pairs with a 150 × 150 µm2 cross-sectional area and 13 µm height, which are electrically connected by top and bottom Au interconnects via a flip-chip bonding approach. The fabricated devices achieve net cooling of 1.2 K at 100 mA and 0.71 K at 75 mA at room temperature. Results indicate that high electrical contact resistance at the bonding interfaces limits the cooling performance. Further, COMSOL simulations predict a net cooling of 6.18 K when the leg height is increased to 60 µm and the contact resistivity is reduced to 10-11 Ω.m2. This study provides quantitative design guidelines for micro-TEC interfaces and geometry and demonstrates the feasibility of direct micro-TEC integration onto silicon platforms for on-chip thermal management of photonic components.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.articleid128468en
dc.identifier.citationKaur, R., Tanwar, A., O’Brien, P. and Razeeb, K. M. (2025) 'Flip-chip bonded micro-thermoelectric coolers for on-chip thermal management of integrated photonic devices', Applied Thermal Engineering, 280(5), 128468 (10pp). https://doi.org/10.1016/j.applthermaleng.2025.128468en
dc.identifier.doi10.1016/j.applthermaleng.2025.128468en
dc.identifier.endpage10en
dc.identifier.issn1359-4311en
dc.identifier.issued5en
dc.identifier.journaltitleApplied Thermal Engineeringen
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/17980
dc.identifier.volume280en
dc.language.isoenen
dc.publisherElsevier Ltd.en
dc.relation.ispartofApplied Thermal Engineeringen
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/Research Centres Programme/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/en
dc.relation.projectinfo:eu-repo/grantAgreement/EC/HE::HORIZON-RIA/101160642/EU/RECYCLING INDUSTRIAL WASTE HEAT THROUGH THE APPLICATION OF THERMOPHOTOVOLTAIC AND THERMOELECTRIC: A NOVEL HYBRID TECHNOLOGY FOR ELECTRICITY GENERATION/INFERNOen
dc.rights© 2025, Elsevier Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies.en
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/en
dc.subjectMicro-thermoelectric cooleren
dc.subjectElectrodepositionen
dc.subjectThin filmen
dc.subjectFlip-chip bondingen
dc.titleFlip-chip bonded micro-thermoelectric coolers for on-chip thermal management in integrated photonicsen
dc.typeArticle (peer-reviewed)en
dc.typejournal-articleen
oaire.citation.volume280en
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