Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization

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dc.contributor.authorChen, Weimin
dc.contributor.authorMcCloskey, Paul
dc.contributor.authorRohan, James F.
dc.contributor.authorByrne, Patrick
dc.contributor.authorMcNally, Patrick J.
dc.contributor.funderEnterprise Irelanden
dc.date.accessioned2019-03-28T10:15:02Z
dc.date.available2019-03-28T10:15:02Z
dc.date.issued2007-03-19
dc.date.updated2019-03-28T10:06:07Z
dc.description.abstractThe reliability of electroless Ni(P) under-bump metallization (UBM) was evaluated via temperature cycling and solder bump shear strength tests. Commercial diodes and dummy dies fabricated in-house were used as substrates for the electroless Ni(P) UBM deposition. Solder bumps were formed after reflowing eutectic 63Sn37Pb solder foils over the Ni(P) UBM. The solder bump shear strength was measured before and after different temperature cycling. The results from this study showed that the UBM thickness and dimension had important effects on the solder bump shear strength and reliability. Both the larger UBM dimension and larger UBM thickness tended to induce higher stress in the UBM, which resulted in the lower solder bump shear strength and lower temperature cycling reliability. A better UBM structure solution for high current electronic packaging application is indicated in this paper.en
dc.description.sponsorshipEnterprise Ireland (Strategic Research Grants Scheme 2000 Project: Low Loss Power Device Packaging (LOLPAC))en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationChen, W., McCloskey, P., Rohan, J. F., Byrne, P. and McNally, P. J. (2007) 'Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization', IEEE Transactions on Components and Packaging Technologies, 30(1), pp. 144-151. doi:10.1109/TCAPT.2007.892094en
dc.identifier.doi10.1109/TCAPT.2007.892094
dc.identifier.endpage151en
dc.identifier.issn1521-3331
dc.identifier.issn1557-9972
dc.identifier.issued1en
dc.identifier.journaltitleIEEE Transactions on Components and Packaging Technologiesen
dc.identifier.startpage144en
dc.identifier.urihttps://hdl.handle.net/10468/7679
dc.identifier.volume30en
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.urihttps://ieeexplore.ieee.org/document/4135412
dc.rights© 2007, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectElectroless Ni(P) depositionen
dc.subjectElectronic packagingen
dc.subjectReliabilityen
dc.subjectShear strength testen
dc.subjectSolder bumpen
dc.subjectThermal cyclingen
dc.subjectUnder-bump metallizationen
dc.subjectUBMen
dc.subjectNi(P) filmsen
dc.subjectAluminum bondpadsen
dc.subjectIntrinsic stressen
dc.subjectShear-strengthen
dc.subjectSolderen
dc.subjectSn3.5Agen
dc.subjectDepositen
dc.subjectSn37Pben
dc.titlePreparation and temperature cycling reliability of electroless Ni(P) under bump metallizationen
dc.typeArticle (peer-reviewed)en
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