Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications
| dc.contributor.author | Rohan, James F. | |
| dc.contributor.author | O'Riordan, Gerald | |
| dc.contributor.author | Boardman, Jane | |
| dc.contributor.funder | Enterprise Ireland | en |
| dc.date.accessioned | 2019-03-14T11:59:30Z | |
| dc.date.available | 2019-03-14T11:59:30Z | |
| dc.date.issued | 2001-12-11 | |
| dc.date.updated | 2019-03-14T11:54:49Z | |
| dc.description.abstract | A low cost, selective electroless metallisation of integrated circuit (IC) copper bond pads with nickel and gold is demonstrated. This metallurgy can function as a barrier layer/bondable material when deposited as a thin layer or as the chip bump for flip chip applications when deposited to greater heights. Four alternative activation steps for selective electroless nickel deposition on bond pad copper are demonstrated. Selective low cost deposition has been achieved with a proprietary electroless plating bath developed at NMRC and three commercial baths on both sputtered copper substrates and electrolessly deposited copper on titanium nitride barrier layer material. | en |
| dc.description.sponsorship | Enterprise Ireland (Grant number HE1999-262 from the Enterprise Ireland Applied Research Grant Scheme) | en |
| dc.description.status | Peer reviewed | en |
| dc.description.version | Accepted Version | en |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Rohan, J. F., O’Riordan, G. and Boardman, J. (2002) 'Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications', Applied Surface Science, 185(3), pp. 289-297. doi: 10.1016/S0169-4332(01)00982-5 | en |
| dc.identifier.doi | 10.1016/S0169-4332(01)00982-5 | |
| dc.identifier.endpage | 297 | en |
| dc.identifier.issn | 0169-4332 | |
| dc.identifier.journaltitle | Applied Surface Science | en |
| dc.identifier.startpage | 289 | en |
| dc.identifier.uri | https://hdl.handle.net/10468/7623 | |
| dc.identifier.volume | 185 | en |
| dc.language.iso | en | en |
| dc.publisher | Elsevier | en |
| dc.relation.uri | http://www.sciencedirect.com/science/article/pii/S0169433201009825 | |
| dc.rights | © 2002 Published by Elsevier Science B.V. This manuscript version is made available under the CC-BY-NC-ND 4.0 license | en |
| dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/4.0/ | en |
| dc.subject | Electroless deposition | en |
| dc.subject | Copper bond pads | en |
| dc.subject | Barrier layer | en |
| dc.subject | Flip chip | en |
| dc.title | Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications | en |
| dc.type | Article (peer-reviewed) | en |
