Transferred III-V materials - novel devices and integration
Corbett, Brian M.
Optical Society of America
Separating the substrate allows thin layers of III-V photonic semiconductor materials and devices to be integrated on foreign templates using transfer-printing. We demonstrate advanced light emitting and detecting devices based on this principle.
Electron beam lithography , Emission , Laser coupling , Laser light , Optical components , Semiconductors
Corbett, B., Loi, R., Quinn, D., O'Callaghan, J. and Liu, N. (2017) 'Transferred III-V materials - novel devices and integration', Integrated Photonics Research, Silicon and Nanophotonics in Proceedings of Advanced Photonics 2017, New Orleans, Louisiana, United States, 24-27 July, ITu2A.4 (3pp). doi:10.1364/IPRSN.2017.ITu2A.4
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