Influence of carbon nanotubes on the electrodeposition of copper interconnects

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dc.contributor.authorChowdhury, Tamjid
dc.contributor.authorRohan, James F.
dc.contributor.funderIrish Research Council for Science, Engineering and Technologyen
dc.contributor.funderIntel Corporationen
dc.date.accessioned2019-03-11T12:49:29Z
dc.date.available2019-03-11T12:49:29Z
dc.date.issued2010-01
dc.date.updated2019-03-11T12:44:07Z
dc.description.abstractThe electrochemistry of the co-deposition of Cu with carbon nanotube, CNTs is studied by voltammetry and chronoamperometry experiments. Electrochemical data shows CNTs have a slightly accelerating influence on the Cu electrodeposition when nafion was added in the bath as a surfactant of CNTs. The amount of CNTs in the deposit is up to 2% by weight. Kinetic data confirms that the addition of CNTs to the Cu baths increases the Cu exchange current density and decreases the equilibrium potential value. The electrical resistivity results show that at room temperature the resistivity of Cu/CNT composites film (2.47 μΩ-cm) is close to the resistivity of Cu film (2.15 μΩ-cm). A clear decrease of sample resistivity is observed with increasing anneal temperature upto 315ºC. The resistivity also increases when the concentration of CNTs is increased from 10 mg/l to 100 mg/l in the bath.en
dc.description.sponsorshipIrish Research Council for Science, Engineering and Technology (IRCSET postgraduate scholarship Enterprise Partnership scheme in collaboration with Intel Ireland Ltd., funded by the National Development Plan)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationChowdhury, T. and Rohan, J. F. (2010) 'Influence of Carbon Nanotubes on the Electrodeposition of Copper Interconnects', ECS Transactions, 25(38), pp. 37-46. doi: 10.1149/1.3390656en
dc.identifier.doi10.1149/1.3390656
dc.identifier.endpage46en
dc.identifier.issn1938-5862
dc.identifier.issued38en
dc.identifier.journaltitleECS Transactionsen
dc.identifier.startpage37en
dc.identifier.urihttps://hdl.handle.net/10468/7600
dc.identifier.volume25en
dc.language.isoenen
dc.publisherElectrochemical Societyen
dc.relation.urihttp://ecst.ecsdl.org/content/25/38/37
dc.rights© 2010 ECS - The Electrochemical Societyen
dc.subjectCopperen
dc.subjectCarbon nanotubesen
dc.subjectChronoamperometryen
dc.subjectComposite filmsen
dc.subjectElectric conductivityen
dc.subjectElectrodepositionen
dc.subjectSurface active agentsen
dc.subjectThree dimensionalen
dc.subjectAnneal temperaturesen
dc.subjectCodepositionen
dc.subjectCopper interconnectsen
dc.subjectCu exchangesen
dc.subjectCu filmsen
dc.subjectElectrical resistivityen
dc.subjectElectrochemical dataen
dc.subjectEquilibrium potentialsen
dc.subjectKinetic dataen
dc.subjectRoom temperatureen
dc.titleInfluence of carbon nanotubes on the electrodeposition of copper interconnectsen
dc.typeArticle (peer-reviewed)en
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