Silicon photonic 2.5D multi-chip module transceiver for high-performance data centers

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dc.contributor.authorAbrams, Nathan C.
dc.contributor.authorCheng, Qixiang
dc.contributor.authorGlick, Madeleine
dc.contributor.authorJezzini, Moises
dc.contributor.authorMorrissey, Padraic
dc.contributor.authorO'Brien, Peter
dc.contributor.authorBergman, Keren
dc.contributor.funderU.S. Department of Energyen
dc.contributor.funderAdvanced Research Projects Agency - Energyen
dc.date.accessioned2020-10-16T10:28:25Z
dc.date.available2020-10-16T10:28:25Z
dc.date.issued2020-01-16
dc.date.updated2020-10-16T09:23:03Z
dc.description.abstractWidespread adoption of silicon photonics into datacenters requires that the integration of the driving electronics with the photonics be an essential component of transceiver development. In this article, we describe our silicon photonic transceiver design: a 2.5D integrated multi-chip module (MCM) for 4-channel wavelength division multiplexed (WDM) microdisk modulation targeting 10 Gbps per channel. A silicon interposer is used to provide connectivity between the photonic integrated circuit (PIC) and the commercial transimpedance amplifiers (TIAs). Error free modulation is demonstrated at 10 Gbps with -16 dBm received power for the photonic bare die and at 6 Gbps with -15 dBm received power for the first iteration of the MCM transceiver. In this context, we outline the different integration approaches currently being employed to interface between electronics and photonics - monolithic, 2D, 3D, and 2.5D - and discuss their tradeoffs. Notable demonstrations of the various integration architectures are highlighted. Finally, we address the scalability of the architecture and highlight a subsequent prototype employing custom electronic integrated circuits (EICs).en
dc.description.sponsorshipAdvanced Research Projects Agency - Energy (ENLITENED Grant DEAR000843)en
dc.description.statusPeer revieweden
dc.description.versionPublished Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationAbrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O'Brien, P. and Bergman, K. (2020) 'Silicon photonic 2.5D multi-chip module transceiver for high-performance data centers', Journal of Lightwave Technology, 38(13), pp. 3346-3357. doi: 10.1109/JLT.2020.2967235en
dc.identifier.doi10.1109/JLT.2020.2967235en
dc.identifier.eissn1558-2213
dc.identifier.endpage3357en
dc.identifier.issn0733-8724
dc.identifier.issued13en
dc.identifier.journaltitleJournal of Lightwave Technologyen
dc.identifier.startpage3346en
dc.identifier.urihttps://hdl.handle.net/10468/10659
dc.identifier.volume38en
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.rights© 2020, the Authors. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see http://creativecommons.org/licenses/by/4.0/en
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en
dc.subjectOptical interconnections multichip moduleen
dc.subjectSilicon interposeren
dc.subjectSilicon photonicsen
dc.subjectWavelength division multiplexingen
dc.titleSilicon photonic 2.5D multi-chip module transceiver for high-performance data centersen
dc.typeArticle (peer-reviewed)en
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