Angled flip-chip integration of VCSELs on silicon photonic integrated circuits

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dc.contributor.authorCaut, Alexander
dc.contributor.authorJahed, Mehdi
dc.contributor.authorGoyvaerts, Jeroen
dc.contributor.authorRensing, Marc
dc.contributor.authorKarlsson, Magnus
dc.contributor.authorLarsson, Anders
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorBaets, Roel
dc.contributor.authorO'Brien, Peter
dc.contributor.funderHorizon 2020en
dc.contributor.funderVetenskapsrådeten
dc.date.accessioned2022-07-05T15:15:32Z
dc.date.available2022-07-05T15:15:32Z
dc.date.issued2022-05-05
dc.date.updated2022-07-05T15:04:40Z
dc.description.abstractAn investigation of angled flip-chip integration of a singlemode 850 nm vertical-cavity surface-emitting laser (VCSEL) on a silicon nitride photonic integrated circuit (PIC) is presented. Using numerical FDTD simulations, we consider the conditions under which the VCSEL can be integrated at an angle over a grating coupler with high coupling efficiency and low optical feedback. With both coupling efficiency and feedback decreasing with increasing angle, there is a trade-off. With co-directional coupling, first-order diffraction loss sets in at a critical angle, which further reduces the coupling efficiency. No such critical angle exists for contra-directional coupling. We also experimentally demonstrate angled flip-chip integration of GaAs-based 850 nm single transverse and polarization mode VCSELs over grating couplers on a silicon-nitride PIC. At the output grating coupler, light is either collected by an optical fiber or converted to a photocurrent using a flip-chip integrated GaAs-based photodetector. The latter forms an on-PIC optical link. We measured an insertion loss of 21.9, 17.6 and 20.1 dB with a singlemode fiber, multimode fiber and photodetector over the output grating coupler, respectively.en
dc.description.sponsorshipVetenskapsrådet (2016-06077, iTRAN).en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationCaut, A., Jahed, M., Goyvaerts, J., Rensing, M., Karlsson, M., Larsson, A., Roelkens, G., Baets, R. and O'Brien, P. (2022) 'Angled flip-chip integration of VCSELs on silicon photonic integrated circuits', Journal of Lightwave Technology. doi: 10.1109/JLT.2022.3172781en
dc.identifier.doi10.1109/JLT.2022.3172781en
dc.identifier.eissn1558-2213
dc.identifier.issn0733-8724
dc.identifier.journaltitleJournal of Lightwave Technologyen
dc.identifier.urihttps://hdl.handle.net/10468/13341
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::IA/688519/EU/Silicon Nitride Photonic Integrated Circuit Pilot line for Life Science Applications in the Visible Range/PIX4LIFEen
dc.rights© 2022, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectCoupling efficiencyen
dc.subjectCouplingsen
dc.subjectDiffractionen
dc.subjectDiffraction gratingsen
dc.subjectFlip-chip integrationen
dc.subjectGratingsen
dc.subjectOptical feedbacken
dc.subjectOptical waveguidesen
dc.subjectSilicon-nitride photonic integrated circuiten
dc.subjectVertical cavity surface emitting lasersen
dc.titleAngled flip-chip integration of VCSELs on silicon photonic integrated circuitsen
dc.typeArticle (peer-reviewed)en
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