Optical pitch transformer chiplet for glass interposer: concept and feasibility study

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Date
2025-11-13
Authors
Hwang, How Yuan
He, Xiuyun
O'Brien, Peter A.
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Institute of Electrical and Electronics Engineers (IEEE)
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Abstract
We propose the use of optical-pitch-transformer chiplets, which can be micro-transfer-printed onto glass interposers for beachfront density enhancement. Simulationshows that SiN taper coupling to glass waveguide behaves differently depending on functionality as an emitter or a receiver
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Keywords
Heterogeneous platform , Packaging technology
Citation
Hwang, H. Y., He, X. and O'Brien, P. (2025) 'Optical pitch transformer chiplet for glass interposer: concept and feasibility study', 2025 IEEE Photonics Conference (IPC), Singapore, 9-13 November (2pp).
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https://ieee-ipc.org/
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https://hdl.handle.net/10468/18320
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Tyndall National Institute - Conference Items
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© 2025, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.