Transfer print techniques for heterogeneous integration of photonic components

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dc.contributor.authorCorbett, Brian M.
dc.contributor.authorLoi, Ruggero
dc.contributor.authorZhou, Weidong
dc.contributor.authorLiu, Dong
dc.contributor.authorMa, Zhenqiang
dc.contributor.funderAir Force Office of Scientific Research
dc.contributor.funderArmy Research Office
dc.contributor.funderNational Science Foundation
dc.contributor.funderHorizon 2020
dc.contributor.funderScience Foundation Ireland
dc.date.accessioned2017-09-26T11:39:19Z
dc.date.available2017-09-26T11:39:19Z
dc.date.issued2017
dc.description.abstractThe essential functionality of photonic and electronic devices is contained in thin surface layers leaving the substrate often to play primarily a mechanical role. Layer transfer of optimised devices or materials and their heterogeneous integration is thus a very attractive strategy to realise high performance, low-cost circuits for a wide variety of new applications. Additionally, new device configurations can be achieved that could not otherwise be realised. A range of layer transfer methods have been developed over the years including epitaxial lift-off and wafer bonding with substrate removal. Recently, a new technique called transfer printing has been introduced which allows manipulation of small and thin materials along with devices on a massively parallel scale with micron scale placement accuracies to a wide choice of substrates such as silicon, glass, ceramic, metal and polymer. Thus, the co-integration of electronics with photonic devices made from compound semiconductors, silicon, polymer and new 2D materials is now achievable in a practical and scalable method. This is leading to exciting possibilities in microassembly. We review some of the recent developments in layer transfer and particularly the use of the transfer print technology for enabling active photonic devices on rigid and flexible foreign substrates.en
dc.description.statusPeer revieweden
dc.description.versionPublished Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationCorbett, B., Loi, R., Zhou, W., Liu, D. and Ma, Z. (2017) 'Transfer print techniques for heterogeneous integration of photonic components', Progress in Quantum Electronics, 52 (17pp). doi: 10.1016/j.pquantelec.2017.01.001en
dc.identifier.doi10.1016/j.pquantelec.2017.01.001
dc.identifier.endpage17
dc.identifier.issn0079-6727
dc.identifier.journaltitleProgress in Quantum Electronicsen
dc.identifier.startpage1
dc.identifier.urihttps://hdl.handle.net/10468/4783
dc.identifier.volume52
dc.language.isoenen
dc.publisherPergamon-Elsevier Science Ltden
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::RIA/645314/EU/Transfer-print operations for heterogeneous integration/TOP HIT
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/
dc.relation.urihttp://www.sciencedirect.com/science/article/pii/S0079672717300010?via%3Dihub
dc.rights© 2017, the Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/BY-NC-ND/4.0/).en
dc.rights.urihttp://creativecommons.org/licenses/BY-NC-ND/4.0/
dc.subjectEpitaxial lift offen
dc.subjectLight emitting diodesen
dc.subjectHigh efficiencyen
dc.subjectSolar cellsen
dc.subjectSiliconen
dc.subjectNanomembraneen
dc.subjectSubstrateen
dc.subjectPhotodetectoren
dc.subjectTransistorsen
dc.subjectPerformanceen
dc.titleTransfer print techniques for heterogeneous integration of photonic componentsen
dc.typeArticle (peer-reviewed)en
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