Integrated microinductors on semiconductor substrates for power supply on chip (Invited)

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dc.contributor.authorRohan, James F.
dc.contributor.authorCasey, Declan P.
dc.contributor.authorO'Brien, Joe
dc.contributor.authorHegarty, Margaret
dc.contributor.authorKelleher, Anne-Marie
dc.contributor.authorWang, Ningning
dc.contributor.authorJamieson, Brice
dc.contributor.authorWaldron, Finbarr
dc.contributor.authorKulkarni, Santosh
dc.contributor.authorRoy, Saibal
dc.contributor.authorÓ Mathúna, S. Cian
dc.contributor.funderEnterprise Irelanden
dc.contributor.funderHigher Education Authorityen
dc.date.accessioned2019-03-11T12:31:27Z
dc.date.available2019-03-11T12:31:27Z
dc.date.issued2011-01
dc.date.updated2019-03-11T12:25:14Z
dc.description.abstractMicroinductors were fabricated using electrodeposition for integration on semiconductor substrates. The process was optimised through validated models developed to focus on efficiency and footprint. Lithographic processing was performed to microfabricate Cu coils over a magnetic core. A racetrack design was used to maximise the high frequency response, yielding high inductance density and low DC resistance. The magnetic core was subsequently closed using a magnetic thin film deposition over a dielectric deposited on the Cu coils. Homogeneous ferromagnetic alloy, Ni45Fe55 of uniform thickness over a high aspect-ratio 3D structure has been achieved. Ni45Fe55 was chosen for the fabrication of micromagnetic cores due to its relatively high saturation flux density (1.6 T), resistivity (48 mΩ cm) and anisotropy field (9.5 Oe). The rationale, design, microfabrication process and characterisation results are presented.en
dc.description.sponsorshipEnterprise Ireland (commercialisation fund technology development project CFTD/2008/331); Higher Education Authority (“INSPIRE” Higher Education Authority via PRTLI4)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationRohan, J. F., Casey, D., O'Brien, J., Hegarty, M., Kelleher, A.-M., Wang, N., Jamieson, B., Waldron, F., Kulkarni, S., Roy, S. and O'Mathuna, S. C. (2011) '(Invited) Integrated Microinductors on Semiconductor Substrates for Power Supply on Chip', ECS Transactions, 41(8), pp. 341-347. doi: 10.1149/1.3631510en
dc.identifier.doi10.1149/1.3631510
dc.identifier.endpage347en
dc.identifier.issn1938-5862
dc.identifier.issued8en
dc.identifier.journaltitleECS Transactionsen
dc.identifier.startpage341en
dc.identifier.urihttps://hdl.handle.net/10468/7598
dc.identifier.volume41en
dc.language.isoenen
dc.publisherElectrochemical Societyen
dc.relation.urihttp://ecst.ecsdl.org/content/41/8/341
dc.rights© 2011 ECS - The Electrochemical Societyen
dc.subjectAspect ratioen
dc.subjectGallium nitrideen
dc.subjectMagnetic coresen
dc.subjectMagnetic thin filmsen
dc.subjectSilicon carbideen
dc.subject3D Structureen
dc.subjectAnisotropy fielden
dc.subjectDc resistanceen
dc.subjectFerromagnetic alloysen
dc.subjectHigh aspect ratioen
dc.subjectHigh frequency responseen
dc.subjectLithographic processingen
dc.subjectMicro inductorsen
dc.subjectMicrofabrication processen
dc.subjectMicromagneticsen
dc.subjectPower supply-on-chipen
dc.subjectSaturation flux densityen
dc.subjectSemiconductor substrateen
dc.subjectThin-film depositionsen
dc.titleIntegrated microinductors on semiconductor substrates for power supply on chip (Invited)en
dc.typeArticle (peer-reviewed)en
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