Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates

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dc.contributor.authorChowdhury, Tamjid
dc.contributor.authorCasey, Declan P.
dc.contributor.authorRohan, James F.
dc.contributor.funderIrish Research Council for Science Engineering and Technologyen
dc.contributor.funderIntel Ireland Ltd.en
dc.date.accessioned2014-01-22T13:01:22Z
dc.date.available2014-01-22T13:01:22Z
dc.date.issued2009-06
dc.date.updated2013-12-18T16:18:02Z
dc.description.abstractAnodised aluminium oxide (AAO) templates have been utilised to investigate Cu deposition from a typical sulphate plating bath. The influence of the common additives poly ethylene glycol (PEG), chloride ion (Cl-) and Bis-(sodium sulphopropyl)-disulphide (SPS) on the deposition process has been analysed. The growth of Cu wires or nanotubes (with tube walls of 40-70 nm) is significantly influenced by the action of the additives. In the presence of either Cl- or SPS solid wire growth is observed, however, when PEG is added with Cl- the growth of ordered Cu nanotubes is observed. SPS added to a bath containing Cl- and PEG restores the growth of wires.en
dc.description.sponsorshipIrish Research Council for Science, Engineering and Technology (Postgraduate scholarship Enterprise Partnership scheme)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationCHOWDHURY, T., CASEY, D. P. & ROHAN, J. F. 2009. Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates. Electrochemistry Communications, 11, 1203-1206. http://dx.doi.org/10.1016/j.elecom.2009.04.003en
dc.identifier.doi10.1016/j.elecom.2009.04.003
dc.identifier.endpage1206en
dc.identifier.issn1388-2481
dc.identifier.issued6en
dc.identifier.journaltitleElectrochemistry Communicationsen
dc.identifier.startpage1203en
dc.identifier.urihttps://hdl.handle.net/10468/1325
dc.identifier.volume11en
dc.language.isoenen
dc.publisherElsevieren
dc.relation.urihttp://www.sciencedirect.com/science/article/pii/S1388248109001672
dc.rights© 2009 Elsevier B.V. All rights reserved. NOTICE: this is the author’s version of a work that was accepted for publication in Electrochemistry Communications. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Electrochemistry Communications [Volume 11, Issue 6, June 2009, Pages 1203–1206] http://dx.doi.org/10.1016/j.elecom.2009.04.003en
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/en
dc.subjectTemplatesen
dc.subjectAAOen
dc.subjectCopperen
dc.subjectElectrodepositionen
dc.subjectNanotubesen
dc.subjectAdditivesen
dc.subjectPEGen
dc.subjectCLen
dc.subjectPolyethylene glycolen
dc.subjectGrowth-mechanismen
dc.subjectNanowire arraysen
dc.subjectCopperen
dc.subjectDepositionen
dc.subjectFabricationen
dc.subjectChlorideen
dc.titleAdditive influence on Cu nanotube electrodeposition in anodised aluminium oxide templatesen
dc.typeArticle (peer-reviewed)en
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