Hybrid integration and packaging of grating-coupled silicon photonics

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dc.check.embargoformatNot applicableen
dc.check.infoNo embargo requireden
dc.check.opt-outNot applicableen
dc.check.reasonNo embargo requireden
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dc.contributor.advisorO'Brien, Peteren
dc.contributor.advisorPeters, Frank H.en
dc.contributor.authorSnyder, Bradley William
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2014-03-10T17:30:42Z
dc.date.available2014-03-10T17:30:42Z
dc.date.issued2013
dc.date.submitted2013
dc.description.abstractThis thesis covers both the packaging of silicon photonic devices with fiber inputs and outputs as well as the integration of laser light sources with these same devices. The principal challenge in both of these pursuits is coupling light into the submicrometer waveguides that are the hallmark of silicon-on-insulator (SOI) systems. Previous work on grating couplers is leveraged to design new approaches to bridge the gap between the highly-integrated domain of silicon, the Interconnected world of fiber and the active region of III-V materials. First, a novel process for the planar packaging of grating couplers with fibers is explored in detail. This technology allows the creation of easy-to-use test platforms for laser integration and also stands on its own merits as an enabling technology for next-generation silicon photonics systems. The alignment tolerances of this process are shown to be well-suited to a passive alignment process and for wafer-scale assembly. Furthermore, this technology has already been used to package demonstrators for research partners and is included in the offerings of the ePIXfab silicon photonics foundry and as a design kit for PhoeniX Software’s MaskEngineer product. After this, a process for hybridly integrating a discrete edge-emitting laser with a silicon photonic circuit using near-vertical coupling is developed and characterized. The details of the various steps of the design process are given, including mechanical, thermal, optical and electrical steps. The interrelation of these design domains is also discussed. The construction process for a demonstrator is outlined, and measurements are presented of a series of single-wavelength Fabry-Pérot lasers along with a two-section laser tunable in the telecommunications C-band. The suitability and potential of this technology for mass manufacture is demonstrated, with further opportunities for improvement detailed and discussed in the conclusion.en
dc.description.sponsorshipScience Foundation Ireland (07/SRC/I1173)en
dc.description.statusNot peer revieweden
dc.description.versionAccepted Version
dc.format.mimetypeapplication/pdfen
dc.identifier.citationSnyder, B. W. 2013. Hybrid integration and packaging of grating-coupled silicon photonics. PhD Thesis, University College Cork.en
dc.identifier.endpage118
dc.identifier.urihttps://hdl.handle.net/10468/1455
dc.language.isoenen
dc.publisherUniversity College Corken
dc.rights© 2013 Bradley W. Snyderen
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/en
dc.subjectSilicon photonicsen
dc.subjectPhotonics packagingen
dc.subjectHybrid integrationen
dc.subjectSilicon-on-insulator technologyen
dc.subject.lcshLasersen
dc.subject.lcshPhotonicsen
dc.thesis.opt-outfalse*
dc.titleHybrid integration and packaging of grating-coupled silicon photonicsen
dc.typeDoctoral thesisen
dc.type.qualificationlevelDoctoralen
dc.type.qualificationnamePhD (Science)en
ucc.workflow.supervisorpeter.obrien@tyndall.ie*
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