Comparing laser hybrid-integration and fiber coupling with standard grating couplers on Si-PICs

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dc.contributor.authorZagaglia, Luca
dc.contributor.authorFloris, Francesco
dc.contributor.authorCarroll, Lee
dc.contributor.authorO'Brien, Peter A.
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2018-12-13T15:18:10Z
dc.date.available2018-12-13T15:18:10Z
dc.date.issued2018-11-27
dc.date.updated2018-12-13T15:14:17Z
dc.description.abstractWe compare the simulated optical insertion-losses and fabrication-tolerances of a micro-optical bench (MOB) for laser hybrid-integration on the 220nm Silicon-on-Insulator (SOI) photonic-platform to standard fiber-to-grating coupling. Our millimeter-scale two-dimensional finite difference time domain (2D-FDTD) simulation captures (i) aberration, (ii) reflection, (iii) diffraction, and (iv) wave-guiding effects in a single-shot and completely self-consistent way, indicating that light from a laser-diode can be coupled to the SOI photonic integrated circuit (PIC) with a 2.8dB insertion-loss at 1550nm. This insertion loss is just 1.0dB higher than for a standard Fiber-to-PIC grating-coupler, and is due to a combination of interface-reflections and aberration-effects from the micro-optical elements in the MOB. We use further 2D-FDTD simulations to investigate the alignment and manufacturing tolerances of the MOB, and show that these are compatible with practical photonic-packaging processes for mass-manufacture.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationZagaglia, L., Floris, F., Carroll, L. and O’Brien, P. (2018) 'Comparing Laser Hybrid-Integration and Fiber Coupling with Standard Grating Couplers on Si-PICs', IEEE Photonics Technology Letters, In Press, doi: 10.1109/LPT.2018.2883211en
dc.identifier.doi10.1109/LPT.2018.2883211
dc.identifier.endpage4en
dc.identifier.issn1041-1135
dc.identifier.journaltitleIEEE Photonics Technology Lettersen
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/7221
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/en
dc.relation.urihttps://ieeexplore.ieee.org/abstract/document/8546801
dc.rights© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectGratingsen
dc.subjectOptical fiber couplersen
dc.subjectCouplingsen
dc.subjectStandardsen
dc.subjectPhotonicsen
dc.subjectFiber gratingsen
dc.subjectIntegrated circuit packagingen
dc.subjectLaser applicationsen
dc.subjectOptical fibersen
dc.titleComparing laser hybrid-integration and fiber coupling with standard grating couplers on Si-PICsen
dc.typeArticle (peer-reviewed)en
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