Cu electrodeposition from methanesulfonate electrolytes for ULSI and MEMS applications

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dc.contributor.authorHasan, Maksudul
dc.contributor.authorRohan, James F.
dc.contributor.funderEnterprise Irelanden
dc.date.accessioned2014-01-29T17:30:33Z
dc.date.available2014-01-29T17:30:33Z
dc.date.copyright2010
dc.date.issued2010-05
dc.date.updated2013-04-26T11:58:05Z
dc.description.abstractMethanesulfonic acid (MSA) is an alternative to sulfuric acid electrolyte for metal deposition. The electrochemical nucleation and growth of Cu on a glassy carbon electrode in methanesulfonate was compared with sulfate baths. The overpotential for Cu deposition was much smaller in the MSA bath compared to the traditional sulfuric acid bath, and Cu nucleation occurred at a higher rate in the MSA bath. The measured diffusion coefficient value for Cu deposition from the MSA bath was 6.82x10(-6) cm(2)/s. UV-visible spectroscopic results confirmed that the coordination of Cu species was the same in both electrolytes. Cu electrodeposition on Ni sputtered Si substrate from the high efficiency MSA bath was photoresist-compatible with no void formation. One-dimensional Cu nanorods were also deposited through an anodized aluminum oxide template on a Ni evaporated seed layer substrate, showing potential applications as electrical interconnects in ultralarge scale integration (ULSI) and microelectromechanical systems (MEMS).en
dc.description.sponsorshipEnterprise Ireland (Technology Development Project CFTD/05/IT/317))en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationHASAN, M. & ROHAN, J. F. 2010. Cu Electrodeposition from Methanesulfonate Electrolytes for ULSI and MEMS Applications. Journal of The Electrochemical Society, 157, D278-D282. doi: 10.1149/1.3332729en
dc.identifier.doi10.1149/1.3332729
dc.identifier.endpage282en
dc.identifier.issn0013-4651
dc.identifier.issued5en
dc.identifier.journaltitleJournal of the Electrochemical Societyen
dc.identifier.startpage278en
dc.identifier.urihttps://hdl.handle.net/10468/1346
dc.identifier.volume157en
dc.language.isoenen
dc.publisherElectrochemical Societyen
dc.relation.urihttp://jes.ecsdl.org/content/157/5/D278.abstract
dc.rights© The Electrochemical Society, Inc. 2010. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in HASAN, M. & ROHAN, J. F. 2010. Cu Electrodeposition from Methanesulfonate Electrolytes for ULSI and MEMS Applications. Journal of The Electrochemical Society, 157, D278-D282.en
dc.subjectULSIen
dc.subjectCopperen
dc.subjectDiffusionen
dc.subjectElectrodepositionen
dc.subjectElectrolytesen
dc.subjectInterconnectionsen
dc.subjectMicromechanical devicesen
dc.subjectOrganic compoundsen
dc.subjectPhotoresistsen
dc.subjectInterconnect metallizationen
dc.titleCu electrodeposition from methanesulfonate electrolytes for ULSI and MEMS applicationsen
dc.typeArticle (peer-reviewed)en
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