Electrochemical properties of Cu deposition from methanesulphonate electrolytes for ULSI and MEMS applications

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dc.contributor.authorHasan, Maksudul
dc.contributor.authorCasey, Declan P.
dc.contributor.authorRohan, James F.
dc.contributor.funderEnterprise Irelanden
dc.date.accessioned2019-03-11T15:15:08Z
dc.date.available2019-03-11T15:15:08Z
dc.date.issued2009-05
dc.date.updated2019-03-11T15:11:45Z
dc.description.abstractMethanesulphonic acid (MSA) is an alternative to sulphuric acid electrolytes. The electrochemical nucleation and growth of Cu on a glassy carbon (GC) electrode was studied from the methanesulphonate and sulphate baths. The overpotential for Cu deposition was much smaller in the MSA bath compared to the traditional sulphuric acid bath. Cu nucleation occurred at a higher rate in the MSA bath. The measured diffusion coefficient value for Cu deposition from the MSA bath was 6.82 x 10-6 cm2/s. The UV-Vis spectroscopic results confirmed that the coordination of Cu species was the same in both electrolytes. Cu electrodeposition on Ni sputtered Si substrate from the high efficiency MSA bath was found to be photoresist compatible with no void formation. 1D Cu nanorods were also deposited through AAO template on a Ni evaporated seed layer substrate showing potential applications as interconnects in ULSI and MEMS.en
dc.description.sponsorshipEnterprise Ireland (Technology Development Project CFTD/05/IT/317)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationHasan, M., Casey, D. and Rohan, J. (2009) 'Electrochemical Properties of Cu Deposition from Methanesulphonate Electrolytes for ULSI and MEMS Applications', ECS Transactions, 19(24), pp. 57-66. doi: 10.1149/1.3246598en
dc.identifier.doi10.1149/1.3246598
dc.identifier.endpage66en
dc.identifier.issn1938-5862
dc.identifier.issued24en
dc.identifier.journaltitleECS Transactionsen
dc.identifier.startpage57en
dc.identifier.urihttps://hdl.handle.net/10468/7605
dc.identifier.volume19en
dc.language.isoenen
dc.publisherElectrochemical Societyen
dc.relation.urihttp://ecst.ecsdl.org/content/19/24/57
dc.rights© 2009 ECS - The Electrochemical Societyen
dc.subjectElectrochemical propertiesen
dc.subjectElectrolytesen
dc.subjectGlassy carbonen
dc.subjectNanorodsen
dc.subjectNucleationen
dc.subjectPhotoresistsen
dc.subjectSulfuric aciden
dc.subjectAAO templateen
dc.subjectCu depositionen
dc.subjectCu speciesen
dc.subjectDiffusionen
dc.subjectCoefficientsen
dc.subjectElectrochemical nucleationen
dc.subjectGlassy carbon electrodesen
dc.subjectHigh efficiencyen
dc.subjectMEMS applicationsen
dc.subjectMethanesulphonateen
dc.subjectMethanesulphonic aciden
dc.subjectOverpotentialen
dc.subjectPotential applicationsen
dc.subjectSeed layeren
dc.subjectSi substratesen
dc.subjectSulphate bathen
dc.subjectSulphuric acidsen
dc.subjectVoid formationen
dc.titleElectrochemical properties of Cu deposition from methanesulphonate electrolytes for ULSI and MEMS applicationsen
dc.typeArticle (peer-reviewed)en
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