MEMS based electrochemical process for fabrication of laminated micro-inductors on silicon

Simple item page
dc.check.date2018-02-11
dc.check.infoAccess to this item is restricted until 24 months after publication by the request of the publisher.en
dc.contributor.authorAnthony, Ricky
dc.contributor.authorÓ Mathúna, S. Cian
dc.contributor.authorRohan, James F.
dc.contributor.funderEuropean Commissionen
dc.contributor.funderSeventh Framework Programmeen
dc.date.accessioned2017-02-28T15:28:27Z
dc.date.available2017-02-28T15:28:27Z
dc.date.issued2016-02-11
dc.date.updated2017-02-28T15:18:41Z
dc.description.abstractSoft metallic magnetic alloys (such as Co, Ni and Fe based alloys) have been extensively used as core material in integrated inductors and transformers for DC–DC conversion. Although these materials have excellent soft magnetic properties such as high saturation flux density, low coercivity and high permeability; high electronic conductivity makes them susceptible to eddy current losses. As a result, core material thickness is often limited by the skin depth which in turn reduces the inductance density. Laminated magnetic films, where the active layers are separated by a dielectric film can increase the overall core thickness without compromising on its power handling capability. In this work, a CMOS compatible electrochemical-resist-electrochemical based core lamination deposition technique is demonstrated whereby a laminated top magnetic core is fabricated with a self-assembled and selective metallization process on the top SU-8 passivation layer with 2.5 μm Ni81Fe19. The process is site-selective, shows uniform deposition, has excellent step coverage and ideal for metallization of recessed regions in MEMS devices. Moreover, a high frequency measurement of laminated structure suggests uniform permeability for ~ 500 MHz applications.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationAnthony, R., O' Mathúna, C. and Rohan, J. F. (2016) 'MEMS based electrochemical process for fabrication of laminated micro-inductors on silicon', Microelectronic Engineering, 155, pp. 33-38. doi:10.1016/j.mee.2016.02.009en
dc.identifier.doi10.1016/j.mee.2016.02.009
dc.identifier.endpage38en
dc.identifier.issn0167-9317
dc.identifier.journaltitleMicroelectronic Engineeringen
dc.identifier.startpage33en
dc.identifier.urihttps://hdl.handle.net/10468/3708
dc.identifier.volume155en
dc.language.isoenen
dc.publisherElsevieren
dc.relation.projectinfo:eu-repo/grantAgreement/EC/FP7::SP1::ICT/318529/EU/POWER SoC With Integrated PassivEs/POWERSWIPEen
dc.rights© 2016 Elsevier B.V. This manuscript version is made available under the CC-BY-NC-ND 4.0 licenseen
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/en
dc.subjectIntegrated magneticsen
dc.subjectMagnetic MEMSen
dc.subjectMetallizationen
dc.subjectElectroless depositionen
dc.subjectDC–DC Converteren
dc.titleMEMS based electrochemical process for fabrication of laminated micro-inductors on siliconen
dc.typeArticle (peer-reviewed)en
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
2606.pdf
Size:
1.17 MB
Format:
Adobe Portable Document Format
Description:
Accepted Version
Download
License bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
license.txt
Size:
2.71 KB
Format:
Item-specific license agreed upon to submission
Description:
Download
Collections
Tyndall National Institute - Journal Articles