Development and reliability of a direct access sensor using flip chip on flex technology with anisotropic conductive adhesive

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dc.check.embargoformatNot applicableen
dc.check.infoNo embargo requireden
dc.check.opt-outNot applicableen
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dc.contributor.advisorMathewson, Alanen
dc.contributor.advisorStam, Franken
dc.contributor.advisorWright, William M. D.en
dc.contributor.authorJesudoss, Pio
dc.contributor.funderEnterprise Irelanden
dc.contributor.funderHigher Education Authorityen
dc.date.accessioned2016-09-13T11:27:38Z
dc.date.available2016-09-13T11:27:38Z
dc.date.issued2011
dc.date.submitted2011
dc.description.abstractTechnological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic sensing capsules are an example of these. In none of the diagnostic sensing capsules, is the sensor’s first level packaging achieved via Flip Chip Over Hole (FCOH) method using Anisotropic Conductive Adhesive (ACA). In a capsule application with direct access sensor (DAS), ACA not only provides the electrical interconnection but simultaneously seals the interconnect area and the underlying electronics. The development showed that the ACA FCOH was a viable option for the DAS interconnection. Adequate adhesive formed a strong joint that withstood a shear stress of 120N/mm2 and a compressive stress of 6N required to secure the final sensor assembly in place before encapsulation. Electrical characterization of the ACA joint in a fluid environment showed that the ACA was saturated with moisture and that the ions in the solution actively contributed to the leakage current, characterized by the varying rate of change of conductance. Long term hygrothermal aging of the ACA joint showed that a thermal strain of 0.004 and a hygroscopic strain of 0.0052 were present and resulted in a fatigue like process. In-vitro tests showed that high temperature and acidity had a deleterious effect of the ACA and its joint. It also showed that the ACA contact joints positioned at around or over 1mm would survive the gastrointestinal (GI) fluids and would be able to provide a reliable contact during the entire 72hr of the GI transit time. A final capsule demonstrator was achieved by successfully integrating the DAS, the battery and the final foldable circuitry into a glycerine capsule. Final capsule soak tests suggested that the silicone encapsulated system could survive the 72hr gut transition.en
dc.description.sponsorshipEnterprise Ireland (CFTD /05 / 122); Higher Education Authority (PRTLI-IV project NEMBES)en
dc.description.statusNot peer revieweden
dc.description.versionAccepted Version
dc.format.mimetypeapplication/pdfen
dc.identifier.citationJesudoss, P. 2011. Development and reliability of a direct access sensor using flip chip on flex technology with anisotropic conductive adhesive. PhD Thesis, University College Cork.en
dc.identifier.endpage229en
dc.identifier.urihttps://hdl.handle.net/10468/3079
dc.language.isoenen
dc.publisherUniversity College Corken
dc.rights© 2011, Pio Jesudoss.en
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/en
dc.subjectFlip chip over holeen
dc.subjectAnisotropic conductive adhesiveen
dc.subjectDirect access sensoren
dc.subjectSwallowable capsuleen
dc.subjectMechanical characterization of anisotropic conductive adhesiveen
dc.subjectElectrical characterization of anisotropic conductive adhesiveen
dc.subjectReliability testingen
dc.subjectIn-vitro testingen
dc.thesis.opt-outfalse
dc.titleDevelopment and reliability of a direct access sensor using flip chip on flex technology with anisotropic conductive adhesiveen
dc.typeDoctoral thesisen
dc.type.qualificationlevelDoctoralen
dc.type.qualificationnamePHD (Engineering)en
ucc.workflow.supervisorbill.wright@ucc.ie
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