Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars

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dc.contributor.authorWakeel, Saif
dc.contributor.authorHaseeb, A. S. M. A.
dc.contributor.authorHoon, Khoo Ly
dc.contributor.authorAmalina, M. A.
dc.date.accessioned2022-09-12T08:34:55Z
dc.date.available2022-09-12T08:34:55Z
dc.date.issued2022-07-15
dc.date.updated2022-09-09T15:23:38Z
dc.description.abstractIn this work, two commercial no clean fluxes, namely, extremely low residue no-clean flux (NCF) (NC-1) and ordinary NCF (NC-2), were used for the preparation of a fine pitch flip-chip package with a 7.6×7.6 mm 2 Si die on a 17×17 mm 2 organic substrate. One water-soluble (WS) flux was also used for comparison. Moisture sensitivity of the package was evaluated using JESD22-A113D (30 °C/60% relative humidity (RH), 192 h, 3× reflow at 260 °C). Thermal cycling tests were performed following JESD22-A104D (−65 °C to 150 °C). The high-temperature storage life (HTSL) of the packages was investigated using JESD22-A103C (175 °C). Underfill delamination or voids in the package were investigated by confocal scanning acoustic microscopy (C-SAM). Failure characteristics of the packages were also studied using scanning electron microscopy (SEM). After moisture sensitivity level (MSL) test, vehicles prepared by NC-1 and NC-2 showed failure. SEM images revealed severe delamination between underfill and solder mask in the presence of amine/amide and carboxylic acid-based NCF residue. Solder bump crack were found at < 500 cycles for samples prepared with NC-1 which contains tertiary amine and long carbon chain (C8:C10:C12) carboxylic acid-based. However, failure occurred at < 1500 cycles for NC-2 containing secondary amide and shorter carbon chain length (C3) carboxylic acid. Samples prepared using WS did not show any failure for up to 2000 cycles. Thus, NCF-treated assemblies performed poorly in moisture sensitivity and temperature cycling tests.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationWakeel, S., Haseeb, A. S. M. A., Hoon, K. L. and Amalina, M. A. (2022) 'Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars', IEEE Transactions on Components Packaging and Manufacturing Technology, 12(8), pp. 1386-1394. doi: 10.1109/TCPMT.2022.3191604en
dc.identifier.doi10.1109/TCPMT.2022.3191604en
dc.identifier.eissn2156-3985
dc.identifier.endpage1394en
dc.identifier.issn2156-3950
dc.identifier.issued8en
dc.identifier.journaltitleIEEE Transactions on Components Packaging and Manufacturing Technologyen
dc.identifier.startpage1386en
dc.identifier.urihttps://hdl.handle.net/10468/13581
dc.identifier.volume12en
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.rights© 2022, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectCopperen
dc.subjectDelaminationen
dc.subjectElectronic packaging thermal managementen
dc.subjectFlip-chip devicesen
dc.subjectHigh temperature storage lifeen
dc.subjectMoistureen
dc.subjectMoisture sensitivityen
dc.subjectNo-clean fluxen
dc.subjectReliabilityen
dc.subjectReliability analysisen
dc.subjectSensitivityen
dc.subjectThermal cyclingen
dc.subjectUnderfill delaminationen
dc.titleEffects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillarsen
dc.typeArticle (peer-reviewed)en
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