Silicon photonic 2.5D multi-chip module transceiver for high-performance data centers

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dc.contributor.author Abrams, Nathan C.
dc.contributor.author Cheng, Qixiang
dc.contributor.author Glick, Madeleine
dc.contributor.author Jezzini, Moises
dc.contributor.author Morrissey, Padraic
dc.contributor.author O'Brien, Peter
dc.contributor.author Bergman, Keren
dc.date.accessioned 2020-10-16T10:28:25Z
dc.date.available 2020-10-16T10:28:25Z
dc.date.issued 2020-01-16
dc.identifier.citation Abrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O'Brien, P. and Bergman, K. (2020) 'Silicon photonic 2.5D multi-chip module transceiver for high-performance data centers', Journal of Lightwave Technology, 38(13), pp. 3346-3357. doi: 10.1109/JLT.2020.2967235 en
dc.identifier.volume 38 en
dc.identifier.issued 13 en
dc.identifier.startpage 3346 en
dc.identifier.endpage 3357 en
dc.identifier.issn 0733-8724
dc.identifier.uri http://hdl.handle.net/10468/10659
dc.identifier.doi 10.1109/JLT.2020.2967235 en
dc.description.abstract Widespread adoption of silicon photonics into datacenters requires that the integration of the driving electronics with the photonics be an essential component of transceiver development. In this article, we describe our silicon photonic transceiver design: a 2.5D integrated multi-chip module (MCM) for 4-channel wavelength division multiplexed (WDM) microdisk modulation targeting 10 Gbps per channel. A silicon interposer is used to provide connectivity between the photonic integrated circuit (PIC) and the commercial transimpedance amplifiers (TIAs). Error free modulation is demonstrated at 10 Gbps with -16 dBm received power for the photonic bare die and at 6 Gbps with -15 dBm received power for the first iteration of the MCM transceiver. In this context, we outline the different integration approaches currently being employed to interface between electronics and photonics - monolithic, 2D, 3D, and 2.5D - and discuss their tradeoffs. Notable demonstrations of the various integration architectures are highlighted. Finally, we address the scalability of the architecture and highlight a subsequent prototype employing custom electronic integrated circuits (EICs). en
dc.description.sponsorship Advanced Research Projects Agency - Energy (ENLITENED Grant DEAR000843) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.rights © 2020, the Authors. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see http://creativecommons.org/licenses/by/4.0/ en
dc.rights.uri https://creativecommons.org/licenses/by/4.0/ en
dc.subject Optical interconnections multichip module en
dc.subject Silicon interposer en
dc.subject Silicon photonics en
dc.subject Wavelength division multiplexing en
dc.title Silicon photonic 2.5D multi-chip module transceiver for high-performance data centers en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Moises Jezzini, Tyndall Photonics, University College Cork, Cork, Ireland. +353-21-490-3000 Email: moises.jezzini@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2020-10-16T09:23:03Z
dc.description.version Published Version en
dc.internal.rssid 540454137
dc.contributor.funder U.S. Department of Energy en
dc.contributor.funder Advanced Research Projects Agency - Energy en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Journal of Lightwave Technology en
dc.internal.copyrightchecked Yes
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress moises.jezzini@tyndall.ie en
dc.identifier.eissn 1558-2213


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© 2020, the Authors. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see http://creativecommons.org/licenses/by/4.0/ Except where otherwise noted, this item's license is described as © 2020, the Authors. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see http://creativecommons.org/licenses/by/4.0/
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