Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars
Loading...
Date
2022-07-15
Authors
Wakeel, Saif
Haseeb, A. S. M. A.
Hoon, Khoo Ly
Amalina, M. A.
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
Abstract
In this work, two commercial no clean fluxes, namely, extremely low residue no-clean flux (NCF) (NC-1) and ordinary NCF (NC-2), were used for the preparation of a fine pitch flip-chip package with a 7.6×7.6 mm 2 Si die on a 17×17 mm 2 organic substrate. One water-soluble (WS) flux was also used for comparison. Moisture sensitivity of the package was evaluated using JESD22-A113D (30 °C/60% relative humidity (RH), 192 h, 3× reflow at 260 °C). Thermal cycling tests were performed following JESD22-A104D (−65 °C to 150 °C). The high-temperature storage life (HTSL) of the packages was investigated using JESD22-A103C (175 °C). Underfill delamination or voids in the package were investigated by confocal scanning acoustic microscopy (C-SAM). Failure characteristics of the packages were also studied using scanning electron microscopy (SEM). After moisture sensitivity level (MSL) test, vehicles prepared by NC-1 and NC-2 showed failure. SEM images revealed severe delamination between underfill and solder mask in the presence of amine/amide and carboxylic acid-based NCF residue. Solder bump crack were found at < 500 cycles for samples prepared with NC-1 which contains tertiary amine and long carbon chain (C8:C10:C12) carboxylic acid-based. However, failure occurred at < 1500 cycles for NC-2 containing secondary amide and shorter carbon chain length (C3) carboxylic acid. Samples prepared using WS did not show any failure for up to 2000 cycles. Thus, NCF-treated assemblies performed poorly in moisture sensitivity and temperature cycling tests.
Description
Keywords
Copper , Delamination , Electronic packaging thermal management , Flip-chip devices , High temperature storage life , Moisture , Moisture sensitivity , No-clean flux , Reliability , Reliability analysis , Sensitivity , Thermal cycling , Underfill delamination
Citation
Wakeel, S., Haseeb, A. S. M. A., Hoon, K. L. and Amalina, M. A. (2022) 'Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars', IEEE Transactions on Components Packaging and Manufacturing Technology, 12(8), pp. 1386-1394. doi: 10.1109/TCPMT.2022.3191604
Link to publisher’s version
Copyright
© 2022, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.