Hybrid integration and packaging of grating-coupled silicon photonics

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dc.contributor.advisor O'Brien, Peter en
dc.contributor.advisor Peters, Frank H. en
dc.contributor.author Snyder, Bradley William
dc.date.accessioned 2014-03-10T17:30:42Z
dc.date.available 2014-03-10T17:30:42Z
dc.date.issued 2013
dc.date.submitted 2013
dc.identifier.citation Snyder, B. W. 2013. Hybrid integration and packaging of grating-coupled silicon photonics. PhD Thesis, University College Cork. en
dc.identifier.endpage 118
dc.identifier.uri http://hdl.handle.net/10468/1455
dc.description.abstract This thesis covers both the packaging of silicon photonic devices with fiber inputs and outputs as well as the integration of laser light sources with these same devices. The principal challenge in both of these pursuits is coupling light into the submicrometer waveguides that are the hallmark of silicon-on-insulator (SOI) systems. Previous work on grating couplers is leveraged to design new approaches to bridge the gap between the highly-integrated domain of silicon, the Interconnected world of fiber and the active region of III-V materials. First, a novel process for the planar packaging of grating couplers with fibers is explored in detail. This technology allows the creation of easy-to-use test platforms for laser integration and also stands on its own merits as an enabling technology for next-generation silicon photonics systems. The alignment tolerances of this process are shown to be well-suited to a passive alignment process and for wafer-scale assembly. Furthermore, this technology has already been used to package demonstrators for research partners and is included in the offerings of the ePIXfab silicon photonics foundry and as a design kit for PhoeniX Software’s MaskEngineer product. After this, a process for hybridly integrating a discrete edge-emitting laser with a silicon photonic circuit using near-vertical coupling is developed and characterized. The details of the various steps of the design process are given, including mechanical, thermal, optical and electrical steps. The interrelation of these design domains is also discussed. The construction process for a demonstrator is outlined, and measurements are presented of a series of single-wavelength Fabry-Pérot lasers along with a two-section laser tunable in the telecommunications C-band. The suitability and potential of this technology for mass manufacture is demonstrated, with further opportunities for improvement detailed and discussed in the conclusion. en
dc.description.sponsorship Science Foundation Ireland (07/SRC/I1173) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher University College Cork en
dc.rights © 2013 Bradley W. Snyder en
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/ en
dc.subject Silicon photonics en
dc.subject Photonics packaging en
dc.subject Hybrid integration en
dc.subject Silicon-on-insulator technology en
dc.subject.lcsh Lasers en
dc.subject.lcsh Photonics en
dc.title Hybrid integration and packaging of grating-coupled silicon photonics en
dc.type Doctoral thesis en
dc.type.qualificationlevel Doctoral en
dc.type.qualificationname PhD (Science) en
dc.internal.availability Full text available en
dc.check.info No embargo required en
dc.description.version Accepted Version
dc.contributor.funder Science Foundation Ireland en
dc.description.status Not peer reviewed en
dc.internal.school Physics en
dc.check.type No Embargo Required
dc.check.reason No embargo required en
dc.check.opt-out Not applicable en
dc.thesis.opt-out false *
dc.check.embargoformat Not applicable en
ucc.workflow.supervisor peter.obrien@tyndall.ie *
dc.internal.conferring Autumn Conferring 2013 en


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© 2013 Bradley W. Snyder Except where otherwise noted, this item's license is described as © 2013 Bradley W. Snyder
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