Calculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technology

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dc.contributor.author Feldman, Baruch
dc.contributor.author Dunham, Scott T.
dc.date.accessioned 2017-07-28T11:22:09Z
dc.date.available 2017-07-28T11:22:09Z
dc.date.issued 2009
dc.identifier.citation Feldman, B. and Dunham, S. T. (2009) 'Calculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technology', Applied Physics Letters, 95(22), pp. 222101. doi: 10.1063/1.3257700 en
dc.identifier.volume 95
dc.identifier.issued 22
dc.identifier.startpage 1
dc.identifier.endpage 3
dc.identifier.issn 0003-6951
dc.identifier.issn 1077-3118
dc.identifier.uri http://hdl.handle.net/10468/4348
dc.identifier.doi 10.1063/1.3257700
dc.description.abstract Resistivity augmentation in nanoscale metal interconnects is a performance limiting factor in integrated circuits. Here we present calculations of electron scattering and transmission at the interface between Cu interconnects and their barrier layers, in this case Ta. We also present a semiclassical model to predict the technological impact of this scattering and find that a barrier layer can significantly decrease conductivity, consistent with previously published measurements.(C) 2010 American Institute of Physics. (doi:10.1063/1.3257700) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher AIP Publishing en
dc.relation.uri http://aip.scitation.org/doi/abs/10.1063/1.3257700
dc.rights © 2010 American Institute of Physics.This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Feldman, B. and Dunham, S. T. (2009) 'Calculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technology', Applied Physics Letters, 95(22), pp. 222101 and may be found at http://aip.scitation.org/doi/abs/10.1063/1.3257700 en
dc.subject Total-energy calculations en
dc.subject Wave basis-set en
dc.subject Thin-films en
dc.subject Beta-Ta en
dc.subject Molecular-dynamics en
dc.subject Aluminum films en
dc.subject Resistivity en
dc.subject Metals en
dc.subject Deposition en
dc.subject Transport en
dc.subject Copper en
dc.subject Electrical conductivity en
dc.subject Electrical resistivity en
dc.subject Integrated circuit interconnections en
dc.subject Tantalum en
dc.subject Surface scattering en
dc.subject Interconnects en
dc.title Calculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technology en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Baruch Feldman, Tyndall National Institute, University College Cork, Cork, Ireland, Tyndall National Institute, University College Cork, Cork, Ireland +353-21-490-3000 Email: baruchf@alum.mit.edu en
dc.internal.availability Full text available en
dc.description.version Published Version en
dc.internal.wokid WOS:000272627600025
dc.contributor.funder Intel Corporation
dc.description.status Peer reviewed en
dc.identifier.journaltitle Applied Physics Letters en
dc.identifier.articleid 222101


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