Calculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technology

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dc.contributor.authorFeldman, Baruch
dc.contributor.authorDunham, Scott T.
dc.contributor.funderIntel Corporation
dc.date.accessioned2017-07-28T11:22:09Z
dc.date.available2017-07-28T11:22:09Z
dc.date.issued2009
dc.description.abstractResistivity augmentation in nanoscale metal interconnects is a performance limiting factor in integrated circuits. Here we present calculations of electron scattering and transmission at the interface between Cu interconnects and their barrier layers, in this case Ta. We also present a semiclassical model to predict the technological impact of this scattering and find that a barrier layer can significantly decrease conductivity, consistent with previously published measurements.(C) 2010 American Institute of Physics. (doi:10.1063/1.3257700)en
dc.description.statusPeer revieweden
dc.description.versionPublished Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.articleid222101
dc.identifier.citationFeldman, B. and Dunham, S. T. (2009) 'Calculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technology', Applied Physics Letters, 95(22), pp. 222101. doi: 10.1063/1.3257700en
dc.identifier.doi10.1063/1.3257700
dc.identifier.endpage3
dc.identifier.issn0003-6951
dc.identifier.issn1077-3118
dc.identifier.issued22
dc.identifier.journaltitleApplied Physics Lettersen
dc.identifier.startpage1
dc.identifier.urihttps://hdl.handle.net/10468/4348
dc.identifier.volume95
dc.language.isoenen
dc.publisherAIP Publishingen
dc.relation.urihttp://aip.scitation.org/doi/abs/10.1063/1.3257700
dc.rights© 2010 American Institute of Physics.This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Feldman, B. and Dunham, S. T. (2009) 'Calculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technology', Applied Physics Letters, 95(22), pp. 222101 and may be found at http://aip.scitation.org/doi/abs/10.1063/1.3257700en
dc.subjectTotal-energy calculationsen
dc.subjectWave basis-seten
dc.subjectThin-filmsen
dc.subjectBeta-Taen
dc.subjectMolecular-dynamicsen
dc.subjectAluminum filmsen
dc.subjectResistivityen
dc.subjectMetalsen
dc.subjectDepositionen
dc.subjectTransporten
dc.subjectCopperen
dc.subjectElectrical conductivityen
dc.subjectElectrical resistivityen
dc.subjectIntegrated circuit interconnectionsen
dc.subjectTantalumen
dc.subjectSurface scatteringen
dc.subjectInterconnectsen
dc.titleCalculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technologyen
dc.typeArticle (peer-reviewed)en
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