Design and implementation of the embedded capacitance layers for decoupling of wireless sensor nodes

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dc.contributor.author Zheng, Liqiang
dc.contributor.author Mathewson, Alan
dc.contributor.author O'Flynn, Brendan
dc.contributor.author Hayes, Michael
dc.contributor.author Ó Mathúna, S. Cian
dc.date.accessioned 2012-01-10T16:03:42Z
dc.date.available 2012-01-10T16:03:42Z
dc.date.issued 2010-12
dc.identifier.citation Zheng, Liqiang;Mathewson, Alan;O'Flynn, Brendan;Hayes, Michael;Ó Mathúna, S. Cian (2010) Design and implementation of the embedded capacitance layers for decoupling of wireless sensor nodes 12th Electronics Packaging Technology Conference (EPTC). 8-10 Dec. 2010, Singapore. en
dc.identifier.startpage 687 en
dc.identifier.endpage 690 en
dc.identifier.isbn 978-1-4244-8560-4
dc.identifier.isbn 978-1-4244-8561-1
dc.identifier.uri http://hdl.handle.net/10468/489
dc.identifier.doi 10.1109/EPTC.2010.5702726
dc.description.abstract In this paper, the embedded capacitance material (ECM) is fabricated between the power and ground layers of the wireless sensor nodes, forming an integrated capacitance to replace the large amount of decoupling capacitors on the board. The ECM material, whose dielectric constant is 16, has the same size of the wireless sensor nodes of 3cm*3cm, with a thickness of only 14μm. Though the capacitance of a single ECM layer being only around 8nF, there are two reasons the ECM layers can still replace the high frequency decoupling capacitors (100nF in our case) on the board. The first reason is: the parasitic inductance of the ECM layer is much lower than the surface mount capacitors'. A smaller capacitance value of the ECM layer could achieve the same resonant frequency of the surface mount decoupling capacitors. Simulation and measurement fit this assumption well. The second reason is: more than one layer of ECM material are utilized during the design step to get a parallel connection of the several ECM capacitance layers, finally leading to a larger value of the capacitance and smaller value of parasitic. Characterization of the ECM is carried out by the LCR meter. To evaluate the behaviors of the ECM layer, time and frequency domain measurements are performed on the power-bus decoupling of the wireless sensor nodes. Comparison with the measurements of bare PCB board and decoupling capacitors solution are provided to show the improvement of the ECM layer. Measurements show that the implementation of the ECM layer can not only save the space of the surface mount decoupling capacitors, but also provide better power-bus decoupling to the nodes. en
dc.description.sponsorship Scientific Foundation Ireland (ITOBO (398-CRP)) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IEEE en
dc.relation.ispartof 12th Electronics Packaging Technology Conference (EPTC), 2010. 8-10 Dec, 2010, Singapore
dc.rights (c) 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works. en
dc.subject Embedded capacitance material layers en
dc.subject Capacitance en
dc.subject LCR meter en
dc.subject.lcsh Electronic apparatus and appliances en
dc.subject.lcsh Printed circuits en
dc.subject.lcsh Wireless sensor nodes en
dc.subject.lcsh Surface mount technology en
dc.title Design and implementation of the embedded capacitance layers for decoupling of wireless sensor nodes en
dc.type Conference item en
dc.internal.authorurl http://www.tyndall.ie en
dc.internal.authorcontactother Liqiang Zheng, Heterogeneous Systems Integration, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: liqiang.zheng@tyndall.ie en
dc.internal.authorcontactother Alan Mathewson, Heterogeneous Systems Integration, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: alan.mathewson@tyndall.ie en
dc.internal.authorcontactother Brendan O'Flynn, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: brendan.oflynn@tyndall.ie en
dc.internal.authorcontactother Mike Hayes, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: michael.hayes@tyndall.ie en
dc.internal.authorcontactother Cian O Mathuna, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: cian.omathuna@tyndall.ie en
dc.internal.availability Full text available en
dc.date.updated 2012-01-10T15:50:26Z
dc.description.version Accepted Version en
dc.internal.rssid 119946850
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.internal.copyrightchecked Yes en
dc.internal.licenseacceptance Yes en
dc.internal.conferencelocation Singapore en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en


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