Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators

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dc.contributor.author Liu, Lei
dc.contributor.author Loi, Ruggero
dc.contributor.author Roycroft, Brendan
dc.contributor.author O'Callaghan, James
dc.contributor.author Trindade, António José
dc.contributor.author Kelleher, Steven
dc.contributor.author Gocalińska, Agnieszka M.
dc.contributor.author Thomas, Kevin K.
dc.contributor.author Pelucchi, Emanuele
dc.contributor.author Bower, Christopher A.
dc.contributor.author Corbett, Brian M.
dc.date.accessioned 2018-12-13T13:07:24Z
dc.date.available 2018-12-13T13:07:24Z
dc.date.issued 2019-11-30
dc.identifier.citation Lei, L., Ruggero, L., Brendan, R., James, O. C., Antonio Jose, T., Steven, K., Agnieszka, G., Kevin, T., Emanuele, P., Christopher, A. B. and Brian, C. (2019) 'Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators', Journal of Physics D: Applied Physics, 52(6), 064001 (9 pp). doi: 10.1088/1361-6463/aaf064 en
dc.identifier.volume 52 en
dc.identifier.issued 6 en
dc.identifier.startpage 64001-1 en
dc.identifier.endpage 64001-9 en
dc.identifier.issn 0022-3727
dc.identifier.uri http://hdl.handle.net/10468/7218
dc.identifier.doi 10.1088/1361-6463/aaf064
dc.description.abstract On-chip optical interconnects heterogeneously integrated on silicon wafers by transfer-print technology are presented for the first time. Thin (<5 µm), micron sized light-emitting diodes (LEDs) and photo diodes (PDs) are prefabricated and transfer-printed to silicon wafer with polymer waveguides built between them. Data transmission with total power consumption as low as 1 mW, signal to noise ratio of  >250 and current transfer ratio of 0.1% in a compact volume of  <0.0004 mm3 are demonstrated. Experiment shows that the polymer waveguide between the LED and PD plays a key role in enhancing the data transmission efficiency. Reciprocal performance for bidirectional transmission is also achieved. The results show the potential for cost-effective and low profile form-factor on-chip opto-isolators. en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IOP Publishing en
dc.relation.uri http://stacks.iop.org/0022-3727/52/i=6/a=064001
dc.rights © 2018 IOP Publishing Ltd. This is an author-created, un-copyedited version of an article accepted for publication in Journal of Physics D: Applied Physics. The publisher is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/1361-6463/aaf064 . As the Version of Record of this article has been published on a subscription basis, this Accepted Manuscript will be available for reuse under a CC BY-NC-ND 3.0 licence after a 12 month embargo period. en
dc.rights.uri https://creativecommons.org/licences/by-nc-nd/3.0 en
dc.subject Optical interconnects en
dc.subject Photonic integrated circuits en
dc.subject Heterogeneous integration en
dc.title Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Lei Liu, Tyndall National Institute, University College Cork, Cork, Ireland. +353-21-490-3000 Email: lei.liu@tyndall.ie en
dc.internal.availability Full text available en
dc.check.info Access to this article is restricted until 12 months after publication by request of the publisher. en
dc.check.date 2019-11-30
dc.date.updated 2018-12-13T12:59:08Z
dc.description.version Accepted Version en
dc.internal.rssid 465418119
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.identifier.journaltitle Journal of Physics D: Applied Physics en
dc.internal.copyrightchecked No !!CORA!! en
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress lei.liu@tyndall.ie en
dc.relation.project info:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/ en


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© 2018 IOP Publishing Ltd. This is an author-created, un-copyedited version of an article accepted for publication in Journal of Physics D: Applied Physics. The publisher is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/1361-6463/aaf064 . As the Version of Record of this article has been published on a subscription basis, this Accepted Manuscript will be available for reuse under a CC BY-NC-ND 3.0 licence after a 12 month embargo period. Except where otherwise noted, this item's license is described as © 2018 IOP Publishing Ltd. This is an author-created, un-copyedited version of an article accepted for publication in Journal of Physics D: Applied Physics. The publisher is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/1361-6463/aaf064 . As the Version of Record of this article has been published on a subscription basis, this Accepted Manuscript will be available for reuse under a CC BY-NC-ND 3.0 licence after a 12 month embargo period.
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