Comparing laser hybrid-integration and fiber coupling with standard grating couplers on Si-PICs

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Date
2018-11-27
Authors
Zagaglia, Luca
Floris, Francesco
Carroll, Lee
O'Brien, Peter A.
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Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
10.1109/LPT.2018.2883211
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Abstract
We compare the simulated optical insertion-losses and fabrication-tolerances of a micro-optical bench (MOB) for laser hybrid-integration on the 220nm Silicon-on-Insulator (SOI) photonic-platform to standard fiber-to-grating coupling. Our millimeter-scale two-dimensional finite difference time domain (2D-FDTD) simulation captures (i) aberration, (ii) reflection, (iii) diffraction, and (iv) wave-guiding effects in a single-shot and completely self-consistent way, indicating that light from a laser-diode can be coupled to the SOI photonic integrated circuit (PIC) with a 2.8dB insertion-loss at 1550nm. This insertion loss is just 1.0dB higher than for a standard Fiber-to-PIC grating-coupler, and is due to a combination of interface-reflections and aberration-effects from the micro-optical elements in the MOB. We use further 2D-FDTD simulations to investigate the alignment and manufacturing tolerances of the MOB, and show that these are compatible with practical photonic-packaging processes for mass-manufacture.
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Keywords
Gratings , Optical fiber couplers , Couplings , Standards , Photonics , Fiber gratings , Integrated circuit packaging , Laser applications , Optical fibers
Citation
Zagaglia, L., Floris, F., Carroll, L. and O’Brien, P. (2018) 'Comparing Laser Hybrid-Integration and Fiber Coupling with Standard Grating Couplers on Si-PICs', IEEE Photonics Technology Letters, In Press, doi: 10.1109/LPT.2018.2883211
Link to publisher’s version
https://ieeexplore.ieee.org/abstract/document/8546801
URI
https://hdl.handle.net/10468/7221
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Tyndall National Institute - Journal Articles
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