Design and optimization techniques of over-chip bond-wire microtransformers with LTCC core

Show simple item record Camarda, Antonio Macrelli, Enrico Paganelli, Rudi Paolo Tartagni, Marco Roy, Saibal Romani, Aldo 2019-01-07T11:29:53Z 2019-01-07T11:29:53Z 2017-09-13
dc.identifier.citation Camarda, A., Macrelli, E., Paganelli, R. P., Tartagni, M., Roy, S. and Romani, A. (2018) 'Design and optimization techniques of over-chip bond-wire microtransformers with LTCC core', IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(2), pp. 592-603. doi:10.1109/JESTPE.2017.2751745 en
dc.identifier.volume 6 en
dc.identifier.issued 2 en
dc.identifier.startpage 592 en
dc.identifier.endpage 603 en
dc.identifier.issn 2168-6777
dc.identifier.issn 2168-6785
dc.identifier.doi 10.1109/JESTPE.2017.2751745
dc.description.abstract This paper describes the realization of bond-wire micromagnetics by using standard bonding wires and a toroidal ferromagnetic low-temperature co-fired ceramic core with high resistivity. The proposed fabrication procedure is suitable for the development of magnetic components on the top of an integrated circuit with a small profile and a small size (<;15 mm 2 ). A transformer is designed and applied over chip, working in the MHz range with high inductance (~33 μH) and high effective turns ratio (~20). Applications include bootstrap circuits and micropower conversion for energy harvesting. Measurements demonstrate a maximum secondary Q-factor of 11.6 at 1.3 MHz, and a coupling coefficient of 0.65 with an effective turns ratio of 19, which are among the highest values reported for toroidal miniaturized magnetics. The achieved inductance density is 2 μH/mm 2 , along with an inductance per unit core volume of 15.6 μH/mm 3 , and a dc inductance-to-resistance ratio of 2.23 μH/Ω. The presented technique allows to obtain over-chip magnetics trough a postprocessing of the core, and it is also suitable for high-density power supply in package and power supply on-chip. Finally, a series of optimization techniques for planar core magnetic devices in order to maximize the inductance per unit area is discussed and applied to the considered case. en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) en
dc.rights © 2017, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.subject Energy harvesting applications en
dc.subject On-chip en
dc.subject Boost converter en
dc.subject Magnetic-core en
dc.subject Power en
dc.subject Inductors en
dc.subject Transformer en
dc.subject Silicon en
dc.subject Fabrication en
dc.title Design and optimization techniques of over-chip bond-wire microtransformers with LTCC core en
dc.type Article (peer-reviewed) en
dc.internal.authorcontactother Saibal Roy, Tyndall Microsystems, University College Cork, Cork, Ireland. +353-21-490-3000 Email: en
dc.internal.availability Full text available en 2018-11-26T18:33:48Z
dc.description.version Accepted Version en
dc.internal.rssid 438248672
dc.internal.wokid WOS:000431443200015
dc.description.status Peer reviewed en
dc.identifier.journaltitle IEEE Journal of Emerging and Selected Topics in Power Electronics en
dc.internal.copyrightchecked Yes en
dc.internal.licenseacceptance Yes en
dc.internal.IRISemailaddress en

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