Electrochemical properties of Cu deposition from methanesulphonate electrolytes for ULSI and MEMS applications
Loading...
Files
Accepted version
Date
2009-05
Authors
Hasan, Maksudul
Casey, Declan P.
Rohan, James F.
Journal Title
Journal ISSN
Volume Title
Publisher
Electrochemical Society
Published Version
Abstract
Methanesulphonic acid (MSA) is an alternative to sulphuric acid electrolytes. The electrochemical nucleation and growth of Cu on a glassy carbon (GC) electrode was studied from the methanesulphonate and sulphate baths. The overpotential for Cu deposition was much smaller in the MSA bath compared to the traditional sulphuric acid bath. Cu nucleation occurred at a higher rate in the MSA bath. The measured diffusion coefficient value for Cu deposition from the MSA bath was 6.82 x 10-6 cm2/s. The UV-Vis spectroscopic results confirmed that the coordination of Cu species was the same in both electrolytes. Cu electrodeposition on Ni sputtered Si substrate from the high efficiency MSA bath was found to be photoresist compatible with no void formation. 1D Cu nanorods were also deposited through AAO template on a Ni evaporated seed layer substrate showing potential applications as interconnects in ULSI and MEMS.
Description
Keywords
Electrochemical properties , Electrolytes , Glassy carbon , Nanorods , Nucleation , Photoresists , Sulfuric acid , AAO template , Cu deposition , Cu species , Diffusion , Coefficients , Electrochemical nucleation , Glassy carbon electrodes , High efficiency , MEMS applications , Methanesulphonate , Methanesulphonic acid , Overpotential , Potential applications , Seed layer , Si substrates , Sulphate bath , Sulphuric acids , Void formation
Citation
Hasan, M., Casey, D. and Rohan, J. (2009) 'Electrochemical Properties of Cu Deposition from Methanesulphonate Electrolytes for ULSI and MEMS Applications', ECS Transactions, 19(24), pp. 57-66. doi: 10.1149/1.3246598
Link to publisher’s version
Copyright
© 2009 ECS - The Electrochemical Society