Harvesting electromagnetic energy in the V-band using a rectenna formed by a bow tie integrated with a 6-nm-thick Au/HfO2/Pt metal-insulator-metal diode

Thumbnail Image
5786.pdf(2.5 MB)
Accepted version
Aldrigo, Martino
Dragoman, Mircea
Modreanu, Mircea
Povey, Ian M.
Iordanescu, Sergiu
Vasilache, Dan
Dinescu, Adrian
Shanawani, Mazen
Masotti, Diego
Journal Title
Journal ISSN
Volume Title
Institute of Electrical and Electronics Engineers (IEEE)
Research Projects
Organizational Units
Journal Issue
In this paper, the first demonstration of a bow-tie antenna integrated with a metal-insulator-metal (MIM) diode for electromagnetic energy harvesting in the V-band (i.e., 40-75 GHz) is presented. We have designed, simulated, fabricated, and fully characterized a 60-GHz rectifying antenna (rectenna) based on a vertical Au-HfO2-PtMIM diode with reduced differential resistance. The dielectric used for the MIM structure is a 6-nm-thick amorphous HfO2 grown by atomic layer deposition. For the fabricated MIM device, we report here a current density of 3 x 10(4) A/cm(2) that exceeds the previous values presented in the literature. The vertical MIM-based rectenna is able to efficiently harvest up to 250 mu V from an impinging modulated millimeter-wave signal with -20 dBm of available power, thus offering a voltage responsivity of over 5 V/W. The reported results indicate that the proposed approach is well suited for future low-power solutions much sought after for the energetically autonomous 5G terminal equipment.
Diodes , Energy harvesting , Millimeter-wave (mm-wave) devices , Rectennas , Hafnium compounds , Microwave antennas , Electromagnetics , Schottky diodes , Energy harvesting
Aldrigo, M., Dragoman, M., Modreanu, M., Povey, I., Iordanescu, S., Vasilache, D., Dinescu, A., Shanawani, M. and Masotti, D. (2018) 'Harvesting Electromagnetic Energy in the V -Band Using a Rectenna Formed by a Bow Tie Integrated With a 6-nm-Thick Au/HfO2/Pt Metal–Insulator–Metal Diode', IEEE Transactions on Electron Devices, 65(7), pp. 2973-2980. doi: 10.1109/TED.2018.2835138
© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.