Developing wireless measurement system for building deployed capacitive sensors with optimized RF front end circuit

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dc.contributor.author Jafer, Essa
dc.contributor.author O'Flynn, Brendan
dc.contributor.author Ó Mathúna, S. Cian
dc.contributor.author Buckley, John
dc.date.accessioned 2009-11-09T12:45:06Z
dc.date.available 2009-11-09T12:45:06Z
dc.date.copyright 2008
dc.date.issued 2008
dc.identifier.citation Jafer, E., O'Flynn, B., Ó Mathúna, S.C., Buckley, J. 2008. Developing wireless measurement system for building deployed capacitive sensors with optimized RF front end circuit. In: IEEE, Seventh IEEE Conference on Sensors: IEEE Sensors 2008. Lecce, Italy 26-29 October 2008. en
dc.identifier.isbn 1424425808
dc.identifier.uri http://hdl.handle.net/10468/98
dc.identifier.doi 10.1109/ICSENS.2008.4716663
dc.description.abstract In this paper, a prototype of miniaturized, low power, bi-directional wireless sensor node for wireless sensor networks (WSN) was designed for doors and windows building monitoring. The capacitive pressure sensors have been developed particularly for such application, where packaging size and minimization of the power requirements of the sensors are the major drivers. The capacitive pressure sensors have been fabricated using a 2.4 mum thick strain compensated heavily boron doped SiGeB diaphragm is presented. In order to integrate the sensors with the wireless module, the sensor dice was wire bonded onto TO package using chip on board (COB) technology. The telemetric link and its capabilities to send information for longer range have been significantly improved using a new design and optimization process. The simulation tool employed for this work was the Designerreg tool from Ansoft Corporation. en
dc.description.sponsorship Science Foundation Ireland (CSET - Centre for Science Engineering and Technology) en
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher IEEE en
dc.relation.ispartof The Seventh IEEE Conference on Sensors: IEEE Sensors 2008, October 26-29, 2008, Lecce, Italy
dc.relation.uri http://ieeexplore.ieee.org/xpl/tocresult.jsp?isnumber=4716361&isYear=2008
dc.rights © 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from IEEE. en
dc.subject pressure sensors en
dc.subject capacitive sensors en
dc.subject.lcsh Wireless sensor networks en
dc.title Developing wireless measurement system for building deployed capacitive sensors with optimized RF front end circuit en
dc.type Conference item en
dc.internal.authorurl http://www.tyndall.ie/mai/staff/brendanoflynn.htm en
dc.internal.authorurl http://www.tyndall.ie/mai/staff/cianomathuna.htm en
dc.internal.authorurl http://www.tyndall.ie/mai/staff/johnbuckley.htm en
dc.internal.authorcontactother Essa Jafer, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: essa.jafer@tyndall.ie en
dc.internal.authorcontactother Brendan O'Flynn, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: brendan.oflynn@tyndall.ie en
dc.internal.authorcontactother Cian O'Mathuna, Microelectronics Applications Integration Group, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: cian.omathuna@tyndall.ie en
dc.internal.authorcontactother John Buckley, Microelectronics Applications Integration Group, Tyndall National Institute, Lee Maltings, Cork, Ireland. Email: john.buckley@tyndall.ie en
dc.internal.availability Full text available en
dc.description.version Published Version en
dc.internal.rssid 353756792
dc.contributor.funder Science Foundation Ireland en
dc.description.status Peer reviewed en
dc.internal.IRISemailaddress cian.omathuna@tyndall.ie en


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