Atomically flat low-resistive germanide contacts formed by laser thermal anneal
dc.contributor.author | Shayesteh, Maryam | |
dc.contributor.author | Huet, Karim | |
dc.contributor.author | Toqué-Tresonne, Inès | |
dc.contributor.author | Negru, Razvan | |
dc.contributor.author | Daunt, Chris L. M. | |
dc.contributor.author | Kelly, Niall | |
dc.contributor.author | O'Connell, Dan | |
dc.contributor.author | Yu, Ran | |
dc.contributor.author | Djara, Vladimir | |
dc.contributor.author | Carolan, Patrick B. | |
dc.contributor.author | Petkov, Nikolay | |
dc.contributor.author | Duffy, Ray | |
dc.contributor.funder | Science Foundation Ireland | en |
dc.contributor.funder | Higher Education Authority | en |
dc.date.accessioned | 2019-08-06T11:52:11Z | |
dc.date.available | 2019-08-06T11:52:11Z | |
dc.date.issued | 2013-06-12 | |
dc.date.updated | 2019-08-06T11:40:51Z | |
dc.description.abstract | In this paper, state-of-the-art laser thermal annealing is used to form germanide contacts on n-doped Ge and is systematically compared with results generated by conventional rapid thermal annealing. Surface topography, interface quality, crystal structure, and material stoichiometry are explored for both annealing techniques. For electrical characterization, specific contact resistivity and thermal stability are extracted. It is shown that laser thermal annealing can produce a uniform contact with a remarkably smooth substrate interface with specific contact resistivity two to three orders of magnitude lower than the equivalent rapid thermal annealing case. It is shown that a specific contact resistivity of 2.84 × 10 -7 Ω·cm 2 is achieved for optimized laser thermal anneal energy density conditions. | en |
dc.description.sponsorship | Higher Education Authority (Programme for Research in Third-Level Institutions) | en |
dc.description.status | Peer reviewed | en |
dc.description.version | Accepted Version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.citation | Shayesteh, M., Huet, K., Toqué-Tresonne, I., Negru, R., Daunt, C. L. M., Kelly, N., O'Connell, D., Yu, R., Djara, Vl., Carolan, P. B., Petkov, N. and Duffy, R. (2013) 'Atomically flat low-resistive germanide contacts formed by laser thermal anneal', IEEE Transactions on Electron Devices, 60(7), pp. 2178-2185. doi: 10.1109/TED.2013.2263336 | en |
dc.identifier.doi | 10.1109/TED.2013.2263336 | en |
dc.identifier.eissn | 1557-9646 | |
dc.identifier.endpage | 2185 | en |
dc.identifier.issn | 0018-9383 | |
dc.identifier.issued | 7 | en |
dc.identifier.journaltitle | IEEE Transactions on Electron Devices | en |
dc.identifier.startpage | 2178 | en |
dc.identifier.uri | https://hdl.handle.net/10468/8283 | |
dc.identifier.volume | 60 | en |
dc.language.iso | en | en |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en |
dc.relation.project | info:eu-repo/grantAgreement/SFI/SFI Starting Investigator Research Grant (SIRG)/09/SIRG/I1623/IE/N-type doping in germanium for sub-20nm technology CMOS devices/ | en |
dc.relation.project | info:eu-repo/grantAgreement/SFI/SFI Starting Investigator Research Grant (SIRG)/09/SIRG/I1621/IE/Tuning surface and dopant properties of silicon and germanium nanowires for high performance nanowire-based field-effect transistors/ | en |
dc.relation.uri | https://ieeexplore.ieee.org/abstract/document/6530663 | |
dc.rights | © 2013, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | en |
dc.subject | Electrical contacts | en |
dc.subject | Laser beam annealing | en |
dc.subject | Flat low resistive germanide contacts | en |
dc.subject | Laser thermal annealing | en |
dc.subject | Rapid thermal annealing | en |
dc.subject | Surface topography | en |
dc.subject | Interface quality | en |
dc.subject | Crystal structure | en |
dc.subject | Material stoichiometry | en |
dc.subject | Annealing technique | en |
dc.subject | Electrical characterization | en |
dc.subject | Thermal stability | en |
dc.subject | Smooth substrate interface | en |
dc.subject | Specific contact resistivity | en |
dc.subject | Nickel | en |
dc.subject | Substrates | en |
dc.subject | Lasers | en |
dc.subject | Contacts | en |
dc.subject | Surface treatment | en |
dc.subject | Contact resistance | en |
dc.subject | Germanium | en |
dc.subject | Sheet resistance | en |
dc.subject | Transfer length method | en |
dc.subject | TLM | en |
dc.subject | Optimized laser thermal anneal energy density conditions | en |
dc.title | Atomically flat low-resistive germanide contacts formed by laser thermal anneal | en |
dc.type | Article (peer-reviewed) | en |