Zincate-free, electroless nickel deposition on aluminum bond pads
Rohan, James F.
Murphy, Patricia A.
The Electrochemical Society
A zincate-free electroless nickel deposition on aluminum bond pads is investigated. A three-step, etch, rinse, and electroless plating, is demonstrated for deposition on aluminum bond pads patterned with polyimide. The chemicals used are compatible with this dielectric material. The deposition has been achieved with good selectivity, uniformity, and deposition rate at 40 × 40 μ m aluminum bond pads. The adhesion and contact resistance were also determined and improved through anneals in the range 200-400°C for 1 h. The optimized condition for adhesion and contact resistance was an anneal at 400°C. The combination of a nickel hypophosphite reducing agent and the additives used leads to an active plating bath in the early stages of deposition, by comparison with commercial solutions, and hence, good coverage of the aluminum bond pad using the simplified process.
Aluminium , Nickel , Electroless deposition , Integrated circuit interconnections , Contact resistance , Annealing , Additives , Adhesion
ROHAN, J. F., MURPHY, P. A. & BARRETT, J. 2005. Zincate-Free, Electroless Nickel Deposition on Aluminum Bond Pads. Journal of The Electrochemical Society, 152, C32-C35. doi: 10.1149/1.1836131
© The Electrochemical Society, Inc. 2005. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in ROHAN, J. F., MURPHY, P. A. & BARRETT, J. 2005. Zincate-Free, Electroless Nickel Deposition on Aluminum Bond Pads. Journal of The Electrochemical Society, 152, C32-C35. doi: 10.1149/1.1836131