Flip chip packaging of digital silicon photonics MEMS Switch for cloud computing and data centre

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dc.contributor.authorHwang, How Yuan
dc.contributor.authorLee, Jun Su
dc.contributor.authorSeok, Tae Joon
dc.contributor.authorForencich, Alex
dc.contributor.authorGrant, Hannah R.
dc.contributor.authorKnutson, Dylan
dc.contributor.authorQuack, Niels
dc.contributor.authorHan, Sangyoon
dc.contributor.authorMuller, Richard S.
dc.contributor.authorPapen, George C.
dc.contributor.authorWu, Ming C.
dc.contributor.authorO'Brien, Peter A.
dc.date.accessioned2017-06-02T08:49:53Z
dc.date.available2017-06-02T08:49:53Z
dc.date.issued2017-06
dc.date.updated2017-06-01T12:26:22Z
dc.description.abstractWe report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 × 12 switching ports. The challenges in packaging N2 electrical and 2N optical interconnections are addressed with single-layer electrical redistribution lines of 25 µm line width and space on aluminum nitride interposer and 13° polished 64-channel lidless fiber array (FA) with a pitch of 127 µm. 50 µm diameter solder spheres are laser-jetted onto the electrical bond pads surrounded by suspended MEMS actuators on the device before fluxless flip-chip bonding. A lidless FA is finally coupled near-vertically onto the device gratings using a 6-degree-of-freedom (6-DOF) alignment system. Fiber-to-grating coupler loss of 4.25 dB/facet, 10–11 bit error rate (BER) through the longest optical path, and 0.4 µs switch reconfiguration time have been demonstrated using 10 Gb/s Ethernet data stream.en
dc.description.statusPeer revieweden
dc.description.versionPublished Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.articleid2900210
dc.identifier.citationHwang, H. Y., Lee, J. S., Seok, T. J., Forencich, A., Grant, H. R., Knutson, D., Quack, N., Han, S., Muller, R. S., Papen, G. C., Wu, M. C., O'Brien, P. (2017) 'Flip chip packaging of digital silicon photonics MEMS Switch for cloud computing and data centre', IEEE Photonics Journal, 9(3), 2900210 (10pp). doi: 10.1109/JPHOT.2017.2704097en
dc.identifier.doi10.1109/JPHOT.2017.2704097
dc.identifier.endpage10en
dc.identifier.issn1943-0655
dc.identifier.issued3en
dc.identifier.journaltitleIEEE Photonics Journalen
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/4040
dc.identifier.volume9en
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.rights© 2017, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.en
dc.rights.urihttps://www.ieee.org/publications_standards/publications/rights/copyrightpolicy.htmlen
dc.subjectMicromechanical devicesen
dc.subjectOptical fibersen
dc.subjectOptical switchesen
dc.subjectSwitching circuitsen
dc.subjectFlip chipen
dc.subjectInterposeren
dc.subjectMicro-electro-mechanical systemen
dc.subjectMEMSen
dc.subjectPackagingen
dc.subjectSilicon photonicsen
dc.titleFlip chip packaging of digital silicon photonics MEMS Switch for cloud computing and data centreen
dc.typeArticle (peer-reviewed)en
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