Nanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnect

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dc.check.opt-outNoen
dc.check.reasonThis thesis is due for publication or the author is actively seeking to publish this materialen
dc.contributor.advisorRazeeb Mahmood, Kafilen
dc.contributor.advisorMathewson, Alanen
dc.contributor.authorTao, Jing
dc.contributor.funderEuropean Unionen
dc.date.accessioned2016-06-15T10:53:04Z
dc.date.issued2016
dc.date.submitted2016
dc.description.abstractSemiconductor chip packaging has evolved from single chip packaging to 3D heterogeneous system integration using multichip stacking in a single module. One of the key challenges in 3D integration is the high density interconnects that need to be formed between the chips with through-silicon-vias (TSVs) and inter-chip interconnects. Anisotropic Conductive Film (ACF) technology is one of the low-temperature, fine-pitch interconnect method, which has been considered as a potential replacement for solder interconnects in line with continuous scaling of the interconnects in the IC industry. However, the conventional ACF materials are facing challenges to accommodate the reduced pad and pitch size due to the micro-size particles and the particle agglomeration issue. A new interconnect material - Nanowire Anisotropic Conductive Film (NW-ACF), composed of high density copper nanowires of ~ 200 nm diameter and 10-30 µm length that are vertically distributed in a polymeric template, is developed in this work to tackle the constrains of the conventional ACFs and serves as an inter-chip interconnect solution for potential three-dimensional (3D) applications.en
dc.description.sponsorshipEuropean Union (FP7 scheme project e-BRAINS FP7-ICT-257488)en
dc.description.statusNot peer revieweden
dc.description.versionAccepted Version
dc.format.mimetypeapplication/pdfen
dc.identifier.citationTao, J. 2016. Nanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnect. PhD Thesis, University College Cork.en
dc.identifier.endpage187en
dc.identifier.urihttps://hdl.handle.net/10468/2739
dc.language.isoenen
dc.publisherUniversity College Corken
dc.rights© 2016, Jing Tao.en
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/en
dc.subjectReliabilityen
dc.subject3D integrationen
dc.subjectNanowire anisotropic conductive film (NW-ACF)en
dc.subjectElectrochemical depositionen
dc.subjectThermocompression bondingen
dc.subjectFine-pitch interconnectionen
dc.subjectDaisy-chain resistanceen
dc.subjectBonding interface analysisen
dc.subjectShear strengthen
dc.subjectRF transmissionen
dc.subjectThermal impedanceen
dc.thesis.opt-outfalse
dc.titleNanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnecten
dc.typeDoctoral thesisen
dc.type.qualificationlevelDoctoralen
dc.type.qualificationnamePHD (Engineering)en
ucc.workflow.supervisorkafil.mahmood@tyndall.ie
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