Microlens-assisted expanded beam technique for coupling of laser source to photonic integrated circuit
dc.contributor.author | Patil, Chirag M. | en |
dc.contributor.author | Hwang, How Yuan | en |
dc.contributor.author | Pfeiffer, Martin | en |
dc.contributor.author | Noell, Wilfried | en |
dc.contributor.author | Morrissey, Padraic E. | en |
dc.contributor.author | O’Brien, Peter | en |
dc.contributor.funder | Horizon 2020 | en |
dc.date.accessioned | 2024-10-31T12:10:33Z | |
dc.date.available | 2024-10-31T12:10:33Z | |
dc.date.issued | 2023-11-06 | en |
dc.description.abstract | Efficient coupling interface is crucial for integrating densely-packed photonic sub-assemblies. This study presents a microlens-assisted expanded-mode technique for coupling light from a laser diode into a photonic-integrated-circuit edge coupler. The results show good coupling with relaxed alignment tolerances, paving the way for efficient free-space optical interconnects in chiplet-based photonic packaging. | en |
dc.description.status | Peer reviewed | en |
dc.description.version | Accepted Version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.citation | Patil, C. M., Hwang, H. Y., Pfeiffer, M., Noell, W., Morrissey, P. E. and O’Brien, P. (2023) 'Microlens-assisted expanded beam technique for coupling of laser source to photonic integrated circuit', 2023 28th Microoptics Conference (MOC), Miyazaki, Japan, 24-27 September, pp. 1-2. https://doi.org/10.23919/MOC58607.2023.10302834 | en |
dc.identifier.doi | https://doi.org/10.23919/MOC58607.2023.10302834 | en |
dc.identifier.endpage | 2 | en |
dc.identifier.isbn | 978-4-86348-804-5 | en |
dc.identifier.isbn | 979-8-3503-4055-6 | en |
dc.identifier.startpage | 1 | en |
dc.identifier.uri | https://hdl.handle.net/10468/16606 | |
dc.language.iso | en | en |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en |
dc.relation.ispartof | 2023 28th Microoptics Conference (MOC), Miyazaki, Japan, 24-27 September 2023 | en |
dc.relation.project | info:eu-repo/grantAgreement/EC/H2020::RIA/101016738/EU/Photonic Wafer-Level Integration Packaging and Test/PhotonicLEAP | en |
dc.rights | © 2023, The Japan Society of Appied Physics. Published by IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | en |
dc.subject | Couplings | en |
dc.subject | Semiconductor lasers | en |
dc.subject | Photonic integrated circuits | en |
dc.subject | Packaging | en |
dc.subject | Laser modes | en |
dc.subject | Manufacturing | en |
dc.subject | Laser beams | en |
dc.title | Microlens-assisted expanded beam technique for coupling of laser source to photonic integrated circuit | en |
dc.type | Conference item | en |