Speckle mitigation in laser Doppler vibrometry based on a compact silicon photonics chip
O'Brien, Peter A.
De Melis, Mirko
Institute of Electrical and Electronics Engineers (IEEE)
A compact six-beam homodyne laser Doppler vibrometry (LDV) system is realized based on a silicon-on-insulator (SOI) photonic integrated circuit. We demonstrate a speckle mitigation method by averaging signals from the six channels.
Doppler measurement , Elemental semiconductors , Homodyne detection , Integrated optics , Measurement by laser beam , Silicon , Silicon-on-insulator , Speckle , Vibration measurement , Compact silicon photonics chip , Silicon-on-insulator photonic integrated circuit , Speckle mitigation method , Compact six-beam homodyne laser Doppler vibrometry system , Averaging signals , Biophotonics , Packaging
Li, Y., Zhu, J., Duperron, M., O'Brien, P., Schüler, R., Aasmul, S., De Melis, M. and Baets, R. (2018) ‘Speckle mitigation in laser Doppler vibrometry based on a compact silicon photonics chip’, 2018 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA, 13-18 May, ATu3I.5 (2pp). doi:10.1364/CLEO_AT.2018.ATu3I.5
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