Miniaturization of wireless sensor network nodes

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dc.contributor.authorZheng, Liqiang
dc.contributor.authorMathewson, Alan
dc.contributor.authorO'Flynn, Brendan
dc.contributor.authorHayes, Michael
dc.contributor.authorÓ Mathúna, S. Cian
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2012-02-21T13:11:27Z
dc.date.available2012-02-21T13:11:27Z
dc.date.issued2010
dc.date.updated2012-02-21T12:40:59Z
dc.description.abstractWireless sensor network (WSN) node, typically equipped with a radio transceiver, a small microcontroller and a battery, is different from traditional embedded systems because of its requirement of random deployment, small size and low power consumption. Based on these reasons, miniaturization of the WSN nodes becomes increasingly crucial in embedded system design for numerous applications, such as bio-medical monitoring and body network. In this paper, several technologies of different packaging levels to achieve miniaturization and integration are presented, including flip chip packaging of transceiver and micro-controller bare dies, embedded capacitance and epoxy based three dimensional integration technologies. Comparison of the proposed technologies with the original traditional PCB WSN mote is provided. The current experiments and measurements are also presented to show the benefits brought by these technologies not only in shrinking of the mote size, but also some improvements in electrical performance such as reduction of parasitic passives. It is possible to utilizing several different miniaturization technologies for future miniaturized WSN nodes design. Comparison of these technologies in WSN application is provided as conclusion of this paper .en
dc.description.sponsorshipScience Foundation Ireland (CSET - Centre for Science, Engineering and Technology, grant 07/CE/I1147)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationZheng, L.; Mathewson, A.; O Flynn, B.; Hayes, M.; Ó Mathúna, S.C. (2010) 'Miniaturization of wireless sensor network nodes'. Carpathian Journal of Electronic and Computer Engineering, 3 (1):43-48.en
dc.identifier.endpage48en
dc.identifier.issn1844-9689
dc.identifier.issued1en
dc.identifier.journaltitleCarpathian Journal of Electronic and Computer Engineeringen
dc.identifier.startpage43en
dc.identifier.urihttps://hdl.handle.net/10468/528
dc.identifier.volume3en
dc.language.isoenen
dc.publisherEditura Universitatii de Norden
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Centre for Science Engineering and Technology (CSET)/07/CE/I1147/IE/CSET CLARITY: Bringing Information to Life/
dc.relation.urihttp://ece.ubm.ro/cjece/past_issues.html
dc.rights© 2010, CJECE.en
dc.subjectEmbedded capacitance material (ECM)en
dc.subjectBare die flip-chipen
dc.subjectEpoxy based 3D technologyen
dc.subjectPackaging technologiesen
dc.subject.lcshWireless sensor nodesen
dc.subject.lcshFlip chip technologyen
dc.titleMiniaturization of wireless sensor network nodesen
dc.typeArticle (peer-reviewed)en
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