Enabling volume-compatible photonic medical devices through hybrid integration assembly
Loading...
Date
2024-12-20
Authors
Patil, C. M.
Hall, Matthew L.
Zaruba, P.
Zoldak, M.
Li, Y.
Aasmul, S.
Morrissey, P. E
O’Brien, P.
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
Abstract
A highly integrated and compact photonic module is realised using state-of-the-art wafer-level assembly processes, paving the way for volume production. This advancement opens new avenues for cost-effective and user-friendly point-of-care medical devices, facilitating early detection of cardiovascular conditions.
Description
Keywords
Cardiovascular disease monitoring , Laser Doppler Vibrometry , Photonic integrated circuit , Hybrid laser integration
Citation
Patil, C. M., Hall, M. L., Zaruba, P., Zoldak, M., Li, Y., Aasmul, S., Morrissey, P. E. and O’Brien, P. (2024) 'Enabling volume-compatible photonic medical devices through hybrid integration assembly', 2024 IEEE Photonics Conference (IPC), Rome, Italy, 10-14 November, pp. 1-2. https://doi.org/10.1109/IPC60965.2024.10799614
Link to publisher’s version
Copyright
© 2024, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.