Radix-expanded densely-spaced WDM technology for co-packaged optics switches

Loading...
Thumbnail Image
Date
2026-03-04
Authors
Palmer, R.
Antony, C.
Zheng, B.
Rombouts, M. P. G.
Sarkis, J.
Calabretta, N.
Townsend, P. D.
Talli, G.
Kuschnerov, M.
Journal Title
Journal ISSN
Volume Title
Publisher
SPIE
Published Version
Research Projects
Organizational Units
Journal Issue
Abstract
Optical interconnects are a core technology for scaling AI/ML networks by linking NPU/GPUs directly or through ethernet switches with each other. With switch and link capacities doubling every 2 years, CPO (co-packaged optics) and OIO (optical Input/Output) connectivity solutions are emerging for tackling multiple challenges simultaneously: Reduction of power consumption and latency, and the increase of shoreline bandwidth density. In this work we explore the scaling limitations of DR-based (Direct Reach, parallel fiber output) CPO devices and demonstrate how densely-spaced WDM CPO variants can overcome this bottleneck, while simultaneously supporting a maximum switch radix, within the framework of Horizon Europe project ADOPTION. We demonstrate the first generation of (de-)multiplexer technology and their impact on transmission quality and network architecture.
Description
Keywords
AWG , Co-packaged optics , Demultiplexing , PLC , Port breakout , WDM , [Physics] , [TyndallPhotonics]
Citation
Palmer, R, Antony, C, Zheng, B, Rombouts, M P G, Sarkis, J, Calabretta, N, Townsend, P D, Talli, G & Kuschnerov, M 2026, Radix-expanded densely-spaced WDM technology for co-packaged optics switches. in R T Chen & R C A Pitwon (eds), Optical Interconnects and Packaging 2026. vol. 13903, 1390302, Proceedings of SPIE - The International Society for Optical Engineering, vol. 13903, SPIE. https://doi.org/10.1117/12.3078430
Link to publisher’s version
Copyright
© 2026, Published by SPIE. Downloading of the abstract is permitted for personal use only.