Radix-expanded densely-spaced WDM technology for co-packaged optics switches

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dc.contributor.authorPalmer, R.
dc.contributor.authorAntony, C.
dc.contributor.authorZheng, B.
dc.contributor.authorRombouts, M. P. G.
dc.contributor.authorSarkis, J.
dc.contributor.authorCalabretta, N.
dc.contributor.authorTownsend, P. D.
dc.contributor.authorTalli, G.
dc.contributor.authorKuschnerov, M.
dc.contributor.editorChen, Ray T.
dc.contributor.editorPitwon, Richard C. A.
dc.contributor.funderHorizon Europe
dc.date.accessioned2026-04-22T09:00:03Z
dc.date.available2026-04-22T09:00:03Z
dc.date.issued2026-03-04
dc.description.abstractOptical interconnects are a core technology for scaling AI/ML networks by linking NPU/GPUs directly or through ethernet switches with each other. With switch and link capacities doubling every 2 years, CPO (co-packaged optics) and OIO (optical Input/Output) connectivity solutions are emerging for tackling multiple challenges simultaneously: Reduction of power consumption and latency, and the increase of shoreline bandwidth density. In this work we explore the scaling limitations of DR-based (Direct Reach, parallel fiber output) CPO devices and demonstrate how densely-spaced WDM CPO variants can overcome this bottleneck, while simultaneously supporting a maximum switch radix, within the framework of Horizon Europe project ADOPTION. We demonstrate the first generation of (de-)multiplexer technology and their impact on transmission quality and network architecture.en
dc.description.sponsorshipWe acknowledge funding by the EU HORIZON 2021 project ADOPTION (grant agreement 101070178).
dc.format.extent8
dc.format.mimetypeapplication/pdfen
dc.identifier.authororcidPalmer, R.
dc.identifier.authororcidAntony, C.§0000-0003-0466-8115
dc.identifier.authororcidZheng, B.
dc.identifier.authororcidRombouts, M. P. G.
dc.identifier.authororcidSarkis, J.
dc.identifier.authororcidCalabretta, N.
dc.identifier.authororcidTownsend, P. D.
dc.identifier.authororcidTalli, G.
dc.identifier.authororcidKuschnerov, M.
dc.identifier.authororcidChen, Ray T.
dc.identifier.authororcidPitwon, Richard C. A.
dc.identifier.citationPalmer, R, Antony, C, Zheng, B, Rombouts, M P G, Sarkis, J, Calabretta, N, Townsend, P D, Talli, G & Kuschnerov, M 2026, Radix-expanded densely-spaced WDM technology for co-packaged optics switches. in R T Chen & R C A Pitwon (eds), Optical Interconnects and Packaging 2026. vol. 13903, 1390302, Proceedings of SPIE - The International Society for Optical Engineering, vol. 13903, SPIE. https://doi.org/10.1117/12.3078430
dc.identifier.doi10.1117/12.3078430
dc.identifier.isbn9781510697232
dc.identifier.issn0277-786X
dc.identifier.otherORCID: /0000-0003-0466-8115/work/208370932
dc.identifier.urihttps://hdl.handle.net/10468/18694
dc.identifier.volume13903
dc.language.isoen
dc.publisherSPIE
dc.relation.ispartofseriesProceedings of SPIE - The International Society for Optical Engineering
dc.relation.urihttp://dx.doi.org/10.1117/12.3078430
dc.rights© 2026, Published by SPIE. Downloading of the abstract is permitted for personal use only.
dc.rights.accessrightsopen access
dc.statusPeer reviewed
dc.subjectAWG
dc.subjectCo-packaged optics
dc.subjectDemultiplexing
dc.subjectPLC
dc.subjectPort breakout
dc.subjectWDM
dc.subject[Physics]
dc.subject[TyndallPhotonics]
dc.titleRadix-expanded densely-spaced WDM technology for co-packaged optics switchesen
dc.typeConference item
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