Photonic packaging: transforming silicon photonic integrated circuits into photonic devices

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dc.contributor.funderScience Foundation Irelanden
dc.contributor.funderEuropean Commissionen
dc.contributor.funderSeventh Framework Programmeen
dc.contributor.funderHorizon 2020 Framework Programmeen
dc.date.accessioned2017-01-03T16:03:54Z
dc.date.available2017-01-03T16:03:54Z
dc.date.issued2016-12-15
dc.description.abstractDedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved.en
dc.description.sponsorshipScience Foundation Ireland (SFI/12/RC/2276, SFI/14/ADV/RC2761);en
dc.description.statusPeer revieweden
dc.description.versionPublished Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationCarroll, L., Lee, J.-S., Scarcella, C., Gradkowski, K., Duperron, M., Lu, H., Zhao, Y., Eason, C., Morrissey, P., Rensing, M., Collins, S., Hwang, H. and O’Brien, P. (2016) 'Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices', Applied Sciences, 6(12), 426 (21 pp). doi:10.3390/app6120426en
dc.identifier.doi10.3390/app6120426
dc.identifier.endpage426-21en
dc.identifier.issn2076-3417
dc.identifier.issued12en
dc.identifier.journaltitleApplied Sciencesen
dc.identifier.startpage426-1en
dc.identifier.urihttps://hdl.handle.net/10468/3415
dc.identifier.volume6en
dc.language.isoenen
dc.publisherMDPIen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/FP7::SP1::ICT/318178/EU/Photonic Libraries And Technology for Manufacturing/PLAT4Men
dc.relation.projectinfo:eu-repo/grantAgreement/EC/FP7::SP1::ICT/318704/EU/FDMA Access By Using Low-cost Optical Network Units in Silicon Photonics/FABULOUSen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::RIA/644453/EU/Thermally Integrated Smart Photonics Systems/TIPSen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::RIA/644798/EU/Early stage CARdio Vascular Disease Detection with Integrated Silicon Photonics/CARDISen
dc.relation.urihttp://www.mdpi.com/journal/applsci/special_issues/silicon_photonics
dc.rights© 2016 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/).en
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/
dc.subjectPhotonics packagingen
dc.subjectSilicon photonicsen
dc.subjectIntegrated opticsen
dc.subjectOptoelectronicsen
dc.subjectPhotonic integrated circuits (PICs)en
dc.titlePhotonic packaging: transforming silicon photonic integrated circuits into photonic devicesen
dc.typeArticle (peer-reviewed)en
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